| HS Code | 507517 |
| Chemical Name | Isopropyl Alcohol |
| Molecular Formula | C3H8O |
| Cas Number | 67-63-0 |
| Molecular Weight | 60.1 g/mol |
| Grade | Electronic Grade |
| Purity | ≥99.9% |
| Appearance | Colorless transparent liquid |
| Boiling Point | 82.5 °C |
| Melting Point | -89.5 °C |
| Flash Point | 11.7 °C (closed cup) |
| Density | 0.785 g/cm³ at 20 °C |
| Water Content | ≤500 ppm |
| Evaporation Residue | ≤5 ppm |
| Refractive Index | 1.3772 at 20 °C |
As an accredited Zhejiang Realsun Chemical Co Ltd Isopropyl Alcohol Electronic Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Zhejiang Realsun Electronic Grade Isopropyl Alcohol is packaged in sealed 200-liter drums, 160 kg per drum, ensuring high purity. |
| Container Loading (20′ FCL) | 20′ FCL container loading of electronic-grade isopropyl alcohol from Zhejiang Realsun Chemical, safely packed and sealed for shipment. |
| Shipping | Shipping for Zhejiang Realsun Chemical Co., Ltd.’s Electronic Grade Isopropyl Alcohol requires compliance with UN1219, Class 3 flammable liquid regulations. Product is transported in sealed drums, IBCs, or dedicated tankers, ensuring purity and moisture protection. Proper labeling, segregation from oxidizers, and temperature control are essential for safe, contamination-free delivery. |
| Storage | Store in a cool, dry, well-ventilated area in tightly sealed, grounded containers to preserve electronic-grade purity. Keep away from heat, sparks, open flames, and incompatible oxidizers. Avoid prolonged sunlight and moisture ingress. Maintain temperatures between 15–25°C and strictly follow electrostatic precautions. Use approved safety equipment and ensure secondary containment to prevent spills. |
| Shelf Life | Shelf life is typically 24 months from manufacture when stored sealed in original containers, away from heat, moisture, and ignition sources. |
Metal ion control in electronic-grade IPA is not solely a bulk specification problem. It is also a distribution problem. In a high-purity IPA system, stainless steel 316L storage tanks may be used upstream, but downstream of the final filter the wetted path is usually PFA and PTFE because SEMI F57-sourced polymer components release fewer surface ions than electropolished metal tubing. The critical failure mode is not filter breakthrough but filter-to-housing contact. If o-rings are not perfluoroelastomer, they swell in IPA and release plasticiser or cure residues that increase extractable cation counts at the wafer surface. Point-of-use particle counters and ICP-MS grab sampling are therefore positioned after the filter, not before it. The production control band for semiconductor-grade IPA typically reports individual alkali and transition metals at < 10 ppb and total residue below the detection threshold of the evaporation test. However, published data for this specific Zhejiang Realsun configuration is limited and site-specific qualification is required. Cleanroom exposure during IPA transfer is governed by ISO 14644-1. Dispense rooms are usually Class 5 or better. An IPA stream can be analytically clean in bulk yet fail on-wafer because of extractables added during point-of-use filtration, venting, or dispense.
Marangoni drying of patterned wafers uses an IPA vapour stream entrained in nitrogen at the moving water meniscus. The physical basis is the differential between water surface tension 72.8 mN/m and IPA surface tension 21.7 mN/m at 20 °C. IPA migrates into the aqueous meniscus and lowers the local surface tension, pulling liquid away from high-aspect-ratio features. Vapour generation vessels are operated near the atmospheric boiling point of 82.6 °C. Nitrogen carrier flow and chamber oxygen content are sensor-linked to the exhaust interlock. The flammability envelope is the dominant process constraint. The closed-cup flash point is 12 °C. The lower flammable limit is 2.0 vol%. The upper flammable limit is 12.7 vol% at 25 °C. Exhaust monitoring is normally set to alarm at 10 % of the lower flammable limit, while storage and dispense rooms follow NFPA 30 criteria for flammable liquids. Process optimisation is not simply a temperature increase. Higher vapour pressure improves drying but raises exhaust abatement load, IPA consumption, and explosion risk in the event of a tool drain leak. The terminal output is a dried wafer with reduced pattern collapse in sub-100 nm features. Pattern collapse is a known failure mode when capillary force exceeds the mechanical strength of photoresist lines or porous low-k structures.
Flat-panel display photolithography introduces the same high-purity IPA grade into Gen 8.5 glass cleaning, but the cleaning objective and contamination budget differ from wafer fabs. Glass substrates with edge lengths of approximately 2.5 m × 2.2 m pass through roller brush scrubbers where a mixture of 70 vol% IPA and 30 vol% deionised water is fed to the brush tips before a final neat IPA rinse. The processing concern is not only cation contamination but also particle visibility. A single 2 µm particle on a shadow-mask or photoresist layer can create a short or open defect after etching. For this reason, liquid particle counts per millilitre are specified on electronic-grade IPA, and point-of-use filtration is set at 0.05 µm where the substrate enters the coating tool. The cleaned glass is then dried and immediately coated with photoresist or polyimide alignment material. Residue remaining from technical-grade IPA would create adhesion failures at the resist-glass interface or form haze defects after 380 nm to 700 nm inspection. Terminal products are TFT-LCD arrays, OLED backplanes, and thin-film photomasks where surface condition directly affects aperture ratio and display uniformity.Electronic-grade IPA is used in electronic assembly defluxing when high-reliability boards cannot tolerate ionic residues from aqueous saponifiers or when reworked no-clean solder paste has left halide-bearing activators under low-standoff components. Spray-under-immersion tools and small vapour degreasers apply the solvent to printed circuit assemblies after manual rework. The acceptance criterion for post-wash ionic contamination is 1.56 µg NaCl equivalent/cm² by IPC-TM-650 2.3.25, with boards falling under J-STD-001 Class 3 requirements. IPA dissolves unreacted rosin, solvent-borne activators, and handling oils. It does not hydrolyse the hard polymerised residue formed by some no-clean pastes after multiple reflow cycles. Where this residue remains, an extra saponifier pre-treatment or a terpene-based hydrocarbon cleaner is required before the IPA rinse. The production limitation is drying. Vapour condensing at 82.6 °C penetrates beneath zero-clearance chip packages far better than air-knife drying, but the vapour degreaser must be equipped with cooling coils and freeboard ratio controls that meet occupational exposure limits. Assemblies with solvent-sensitive elastomeric connectors, unsealed relays, or open trimmer potentiometers are masked or excluded because IPA absorption causes swelling and intermittent contact. Terminal products include defence, aerospace, and implantable electronic modules where board ionic cleanliness is directly linked to field corrosion reliability.
In precision optical production, a 99.8 % assay is less critical than non-volatile residue and particle content of the solvent. Lenses, prisms, beamsplitters, and laser mirrors are cleaned with electronic-grade IPA after aqueous detergent steps to remove the final film of adsorbed water and organic contamination before vacuum coating. The wipe-and-drag method is common on flat or spherical surfaces. Cleanroom polyester or polyurethane foam swabs are saturated with IPA and drawn across the optic in one direction to avoid redistributing contaminants. Ultrasonic immersion tanks operating at 40 kHz to 80 kHz are used for complex shapes, provided the optical element is not cemented with Canada balsam or UV-cure adhesives that soften in IPA. The critical acceptance test is visual inspection under a dark-field lamp or oblique illumination. Any haze, drying ring, or solvent-residue pattern found by a 10X to 50X microscope requires recleaning. Surface quality is specified by ISO 10110 scratches and digs, while coating adhesion is verified by tape peel after ion-assisted electron-beam evaporation. Terminal products are anti-reflection lenses, telecom filters, laser output couplers, and dichroic mirrors for medical and industrial laser systems.
A more structurally sensitive application appears in MEMS release processing, where electronic-grade IPA serves as an intermediate solvent for water displacement. In sacrificial-layer etching of silicon dioxide or silicon under polysilicon or metal mechanical structures, the final DI water rinse leaves liquid inside narrow gaps. Capillary stress during ambient air drying pulls adjacent beams together and causes stiction. The release sequence therefore replaces water with IPA through multiple soak-and-drain exchanges in a quartz or PFA bath, then transfers the wafer to a liquid CO₂ or supercritical CO₂ dryer. IPA is miscible with both water and liquid CO₂, so the exchange reduces interfacial energy before final drying. The exchange ratio is process-specific. High-aspect-ratio structures may require a staged sequence with increasing IPA concentration to avoid osmotic stress and interfacial particle redeposition. Thermosetting sacrificial polymers and some photoresists swell in IPA, so compatibility with the release stack must be confirmed by ellipsometric thickness change or FTIR before lot processing. Terminal products include accelerometers, gyroscopes, inkjet printheads, and micro-bolometers where stiction is a direct yield loss. Published optimisation data for Zhejiang Realsun electronic-grade IPA in this exact MEMS solvent-exchange configuration is limited. Qualifying each structural stack in the fab remains mandatory.Competitive Zhejiang Realsun Chemical Co Ltd Isopropyl Alcohol Electronic Grade prices that fit your budget—flexible terms and customized quotes for every order.
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Zhejiang Realsun Chemical Co Ltd Isopropyl Alcohol Electronic Grade, referred to in procurement documentation as IPA-EL, is supplied as a low-residue 2-propanol solvent for critical cleaning and drying steps in semiconductor, flat-panel display, optical, and electronic-component manufacturing. The electronic-grade model is distinguished from technical-grade or analytical-reagent 2-propanol by its release profile for trace metals, anions, particles, and non-volatile residue rather than by assay strength alone. Because GC purity does not by itself guarantee compatibility with gate oxide or thin-film processes, qualification of this product centers on the certificate of analysis and the wet-bench measurement data described in the following sections. The values provided here are representative electronic-grade control windows; lot-specific limits must be taken from the supplier’s certificate of analysis and may vary by packaging and production campaign.
Typical lot-release testing includes gas chromatographic purity, water content by Karl Fischer titration, non-volatile residue, acidity, selected anions by ion chromatography, and trace-metal analysis by inductively coupled plasma mass spectrometry. Representative electronic-grade controls are an assay of ≥99.8 % by peak area, water ≤0.1 wt%, non-volatile residue ≤5 ppm, acidity as acetic acid ≤10 ppm, chloride ≤0.2 ppm, sulfate ≤0.2 ppm, and phosphate ≤0.1 ppm. Elemental impurities such as Na, K, Al, Fe, Cu, Zn, Ca, Mg, Mn, and Ni are usually controlled at ≤5 ppb per element. Liquid-borne particles ≥0.5 μm are frequently controlled to ≤25 particles/mL. The product may be accepted under SEMI C21 as a quality framework, with standards such as ASTM D770 for 2-propanol, ASTM D1364 for water, ASTM D1353 for non-volatile residue, and ASTM D1613 for acidity. These methods provide a common basis for incoming material control, but the electronic-grade classification depends on the full trace-impurity package rather than on any single parameter.
| Release parameter | Test method | Typical electronic-grade control |
|---|---|---|
| Assay as 2-propanol | GC-FID following ASTM D770 | ≥99.8 % |
| Water | Karl Fischer titration per ASTM D1364 | ≤0.1 wt% |
| Non-volatile residue | ASTM D1353 | ≤5 ppm |
| Acidity as acetic acid | ASTM D1613 | ≤10 ppm |
| Chloride | Ion chromatography per SEMI C21 | ≤0.2 ppm |
| Sulfate | Ion chromatography per SEMI C21 | ≤0.2 ppm |
| Phosphate | Ion chromatography per SEMI C21 | ≤0.1 ppm |
| Trace metals, per element | ICP-MS after preconcentration per SEMI C21 | ≤5 ppb |
| Particles ≥0.5 μm | Liquid-borne laser particle counting per SEMI C21 | ≤25 particles/mL |
Final rinse and dry after aqueous cleaning is the most demanding use of electronic-grade IPA. Water has a surface tension of 72.8 mN/m at 20 °C, while dry 2-propanol has a surface tension near 21.7 mN/m at 20 °C. When a wafer is withdrawn from a rinse bath under an IPA vapor or liquid meniscus, the local reduction in surface tension produces a Marangoni-driven flow that displaces water and leaves a thin solvent film. If the IPA has absorbed moisture, the surface-tension difference between the drying fluid and the rinse water declines, and the meniscus may leave residual droplets that produce watermark defects after evaporation. The moisture limit of ≤0.1 wt% is therefore a process-critical boundary for slow-pull and Marangoni dryers. In recirculating IPA baths, water ingress occurs through atmospheric humidity and wafer carry-over. Production-scale equipment may use in-line moisture monitoring, nitrogen blanketing, or membrane drying to hold the water content below the limit. At room humidity above 60 %, open-bath operation without a dry air or nitrogen purge can push the solvent outside its drying window within a single shift; sealed modules and point-of-use monitoring reduce this failure mode. Published data for the exact humidity threshold and wafer-level defect count is limited because the result depends on bath geometry, withdrawal speed, rinse-water quality, and pattern density.
After final purification, the product must be handled in non-shedding, low-extractable distribution systems. Wetted materials commonly include PFA, PTFE, PVDF, and electropolished 316L stainless steel. Carbon steel, copper alloys, and galvanized piping are incompatible because trace iron, zinc, and copper can leach into the fluid and consume a ppb-level metal budget. Point-of-use filtration is typically 0.05 μm or finer on semiconductor wet-bench lines; coarser filtration can allow particle excursions at the dispense point. Dead legs and stagnant sections in distribution piping are a known source of batch-to-batch particle variability. Recirculating loops are preferred over single-pass dead-end lines because continuous flow reduces stagnant residence time and allows filters to maintain lower particle release. Drums and bottles should be stored at 15–25 °C in dry, ventilated flammable-liquid storage. Opened containers should be sealed under nitrogen if the storage environment exceeds 60 % relative humidity. The flash point of 2-propanol is 12 °C closed cup, so transfer equipment must be bonded, grounded, and exhausted in accordance with local flammable-liquid regulations. Return of unused material to the original container is not recommended because particle loading and water uptake during use may compromise the electronic-grade release state.
Electronic-grade IPA is controlled for alkali and alkaline-earth ions because Na, K, and Li migrate under electric fields and can shift capacitance-voltage behavior in metal-oxide-semiconductor structures. The release target of ≤5 ppb per element for Na, K, Al, Fe, Cu, Zn, Ca, Mg, Mn, and Ni is therefore linked to front-end cleanliness rather than to solvent performance alone. A technical-grade IPA can pass GC assay while still containing sodium at concentrations that would fail an incoming mobile-ion specification. Analytical detection by ICP-MS after preconcentration is necessary because direct aspiration can miss sub-ppb excursions. Incoming quality control should split samples under cleanroom conditions, use acid-washed or pre-cleaned bottles, and run the sample promptly to avoid container contamination. If the product is repackaged outside the supplier’s controlled environment, particulate and metallic contamination can be introduced; semiconductor facilities usually require unopened, lot-traceable containers and may reject materials that have been transferred without documented controls. The absence of color, haze, or odor is not a valid release criterion for ionic purity or particle count.
In semiconductor single-wafer processing, the material is applied as a rinse, carrier solvent, or edge-bead removal fluid in spin processors where evaporation must not leave a residue. In batch wet-benches, electronic-grade IPA is used in final displacement-rinse modules, quartzware cleaning, and post-diffusion cleaning. Flat-panel display lines use the product for organic-contamination removal from glass before photoresist coating and for indium tin oxide contact cleaning where residual ions from technical-grade solvent can degrade adhesion. Disk-drive and optical-component manufacturers use the solvent as a final cleaning agent for aluminum substrates, glass platters, and coated lenses because the non-volatile residue limit reduces haze after evaporation. Printed circuit board assembly applies the solvent for flux removal around surface-mount components when substrate and component polymers are compatible with 2-propanol; compatibility with conformal coatings, solder masks, and plastics should be verified before immersion. The product is not a universal substitute for aqueous or chemically active surface preparations.
Electronic-grade IPA differs from technical-grade IPA primarily in trace ionic, particle, and non-volatile residue control rather than in distillation range or basic physical constants. Technical-grade 2-propanol released under ASTM D770 can be acceptable for degreasing and general industrial cleaning, but it is not typically released at ppb-level metal limits or submicron particle counts required for semiconductor front-end specification. Acetone evaporates more quickly and may be chosen for certain heavy or nonpolar residues, but it does not provide the same IPA-water displacement behavior in slow-pull drying systems. n-Methyl-2-pyrrolidone has a higher boiling point and can attack difficult polymer films, but it requires greater attention to residue removal after cleaning. The Zhejiang Realsun electronic-grade product performs the difference through the lot-release package: the value is not in being a different molecule, but in the contaminant budget and packaging cleanliness verified by analysis. Published data comparing defect densities for this specific product against all competing electronic-grade IPA suppliers is limited; users should run split-lot qualification on their own cleaning and drying equipment.
Qualification should begin with the certificate of analysis and safety data sheet, not with product name alone. The certificate should list the method and result for each specification parameter, including detection limits for trace metals. A missing metal-by-metal result at ppb detection limits is a data gap, not evidence of absence. The material should be approved for use only after incoming material control confirms that the container was sealed, lot-traceable, and free from gross particle loading. For process environments that demand formal regulatory conformance, REACH registration for 2-propanol and local flammable-liquid codes remain applicable. RoHS compliance is not a direct property of process solvents, but low-impurity cleaning can support downstream component compliance. If the material is intended for medical-device or food-contact surface cleaning, separate FDA 21 CFR or regional food-contact approval must be demonstrated; electronic-grade quality does not by itself grant food-contact status. Operating limits include moisture exclusion, non-shedding transfer materials, and ignition-source control.
