| HS Code | 447512 |
| Chemical Name | Isopropyl Alcohol |
| Cas Number | 67-63-0 |
| Molecular Formula | C3H8O |
| Purity | >=99.9% |
| Appearance | Clear colorless liquid |
| Density 20 C | 0.785-0.787 g/mL |
| Boiling Point | 82.5°C |
| Melting Point | -89°C |
| Flash Point | 12°C (closed cup) |
| Water Content | <=0.05% |
| Residue On Evaporation | <=0.001% |
| Solubility | Miscible with water, ethanol, ether |
As an accredited Xilong Scientific Co Ltd Isopropyl Alcohol Electronic Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaged in 500 mL amber glass bottles with leak-proof caps, labeled clearly for electronic-grade purity and safety information. |
| Container Loading (20′ FCL) | 20′ FCL of Xilong Scientific electronic-grade isopropyl alcohol, securely packed in drums on pallets, ensuring purity and safe transport. |
| Shipping | Ship as hazardous flammable liquid (Class 3) in UN-approved containers, away from ignition sources and oxidizers. Ensure leak-proof, grounded packaging with proper labeling. Electronic-grade purity demands sealed, contamination-free handling. Comply with IATA/IMDG/ADR regulations, and use dedicated transport to prevent cross-contamination. |
| Storage | Store Xilong Scientific electronic-grade isopropyl alcohol in a clean, tightly sealed, compatible container in a cool, dry, well-ventilated area, away from heat, sparks, open flames, and direct sunlight. Keep the container grounded to prevent static discharge. Avoid moisture and contamination to preserve purity, and use explosion-proof equipment when handling. |
| Shelf Life | Shelf life is typically 3 years when stored sealed in cool, dry, well-ventilated conditions away from heat and ignition sources. |
Front-end semiconductor wet processing uses electronic-grade isopropyl alcohol supplied by Xilong Scientific as the final displacement solvent after ultrapure water rinsing in single-wafer spin cleaning and batch immersion tools. The physical basis is the reduction of capillary force during drying; for a water meniscus trapped between high-aspect-ratio resist or dielectric features, the pressure differential across the interface follows the Young-Laplace relationship. With water at 72.8 mN/m surface tension, pattern collapse in sub-20 nm nodes occurs before the rinse can be removed; replacing the meniscus with isopropyl alcohol at 21.7 mN/m at 25 °C reduces the capillary gradient by approximately 70%. Production-scale single-wafer processors deliver heated isopropyl alcohol vapor through a coaxial N₂ nozzle during spin-off, and the dispense sequence is interlocked with exhaust flow sensors so that solvent vapor remains below the lower flammability limit of 2.0% v/v. Batch-to-batch differences in clarity or water content are observed when 200-L drums are stored in unsealed cleanroom areas because isopropyl alcohol is hygroscopic; moisture ingress above the supplier's upper specification limit produces water marks on polished silicon and changes the evaporation kinetics on the wafer bevel. The material is sampled at the day tank using ICP-MS for Na, K, Fe, Cu, Zn, and a laser particle counter for ≥0.1 μm particles, with acceptance criteria referenced to SEMI C41 and cleanroom classification ISO 14644-1:2015. Compatibility with 248 nm and 193 nm photoresists is process-temperature dependent; at ambient dispense temperatures up to 35 °C, measurable swelling is generally absent, but published data for specific sub-10 nm material stacks remain limited. Process qualification therefore includes film-stress measurement and FTIR spectra after isopropyl alcohol exposure rather than relying only on vendor certificates.
| Control parameter | Reference standard / method | Point of verification |
|---|---|---|
| Particle count ≥0.1 μm | SEMI C41, ISO 14644-1:2015 | Laser particle counter at dispense nozzle |
| Water content | Karl Fischer titration | Drum unloading and day tank |
| Metal ions Na, K, Fe, Cu, Zn | ICP-MS | Certificate of analysis per lot |
| Non-volatile residue | Gravimetric after controlled evaporation | Filtered sample at point of use |
Equipment bottlenecks in Marangoni-drying cells typically originate not from chemical purity but from vapor delivery stability. If the coaxial N₂ line cools below the dew point of the solvent, liquid droplets impact the wafer edge and create localized stains; this failure mode is observed when line temperature drops below the solvent boiling point during idle periods between wafer transfers. In contrast, excessive vapor concentration triggers condensation on the chamber walls and particle shedding. Published data for specific spin-speed and vapor-velocity combinations are limited, but production facilities maintain the wafer and vapor zone at a differential pressure and temperature window that prevents both droplet formation and incomplete meniscus displacement.
In high-density printed circuit board assembly, electronic-grade isopropyl alcohol is applied in inline spray defluxing and localized rework cleaning of no-clean solder paste residues. In production-scale spray-in-air defluxers, the solvent is heated to 40–55 °C and delivered through fan nozzles at pressures up to 3 bar; the objective is to soften rosin-based residues and carry away ionic activators beneath low-standoff BGA packages. Verification of ionic cleanliness is performed by resistivity of solvent extract according to IPC-TM-650 2.3.25, with acceptance thresholds aligned to IPC-J-STD-001 Class 2 or Class 3. Process bottlenecks occur when the solvent bath absorbs flux solids and becomes saturated; at that point spray-nozzle fogging and board streaking appear on production lines before the chemical assay itself shows any change with standard pH or conductivity probes. Closed-loop distillation or continuous bleed-and-feed is therefore used to control the dissolved solids level, and the spent solvent is separated for recovery. Because isopropyl alcohol has a closed-cup flash point near 12 °C, inline defluxing equipment is interlocked with vapor detection and grounded stainless steel piping, and exhaust air is maintained below 25% of the lower flammability limit. For fine-pitch assemblies with quad flat no-lead packages, localized rework cleaning uses a needle dispenser and ion-free compressed air to flush residues from the gap between the component body and the solder mask; cleanroom wipers moistened with the same solvent are used only on the outer perimeter to avoid drafting fiber contamination under the package. Published data for specific package standoff heights remains limited, and the cleaning endpoint is normally established by visual inspection plus periodic ion chromatography on the extracted board coupons.
On Gen 8.5 glass, the edge-bead removal system dispenses electronic-grade isopropyl alcohol through a needle at the panel periphery while the glass is rotated; the solubility of the resist edge in the solvent must be balanced against the risk of solvent wicking into active-area corners. Flat-panel display and OLED front-of-line substrate cleaning also uses the solvent as a rinse before alignment-layer coating. Equipment qualification includes laser particle counter checks per ISO 14644-1:2015 for ≥0.1 μm particles at the dispense point, and contact-angle measurements are recorded to ensure the glass surface remains within the specified pre-coating window. Process engineers observe that over-dispensing creates a thinned resist transition zone that can widen beyond 2 mm on top-gate TFT arrays; under-dispensing leaves an irregular bead that flakes during subsequent plasma etching and becomes a particle source. The high purity requirements for metal ions are driven by the threshold voltage shift in oxide TFT backplanes, so the solvent lot is sampled for Na, K, Fe, Cu, and Zn by ICP-MS before release to production. Because edge-bead removal lines are usually located adjacent to track coats, the solvent distribution loop is kept under nitrogen pressure to exclude moisture and to reduce static charge. The vapor concentration around the coater cup is monitored continuously, and the process is interlocked to stop if the concentration exceeds a preset fraction of the lower explosion limit. Published data for specific coater cup geometries remain limited; equipment makers commonly require that the solvent temperature be held below the cleanroom ambient dew point to prevent condensation on the glass.
During disk substrate cleaning after diamond slurry lapping and after sputtered magnetic layer deposition, electronic-grade isopropyl alcohol serves as the transition solvent between aqueous stages and fluorinated solvent stages in automated disk lines. In production-scale disk cleaning, substrates pass through a multi-stage ultrasonic tank sequence in which the isopropyl alcohol stage is maintained at 35–45 °C and filtered through 0.05 μm PTFE membranes; the solvent removes alumina and diamond cutting debris from the texture lines and evaporates without leaving non-volatile residue if the final air knife uses HEPA-filtered air. In subsequent lubricant dip coating, the disk is withdrawn from a dilute perfluoropolyether solution; pre-wetting with isopropyl alcohol modifies the meniscus shape at the disk edge and reduces lube band non-uniformity. The critical operational limitation is water absorption from humid room air. Water in the solvent can cause adhesive failure of the lubricant monolayer and is detected by Karl Fischer titration before each shift; if water exceeds the user's upper limit, the tank charge is replaced or redistilled. Because disk cleaning is performed in Class 5 cleanliness per ISO 14644-1:2015, solvent containers are equipped with nitrogen blanketing and the tank lid interlocks with the transfer robot to prevent open-air storage. Published data for specific media texture geometries and lube film thicknesses remains limited, and qualifying a new solvent lot includes a full disk glide-height test and contact-angle mapping on the landing zone.
Immediately after solder paste printing in SMT lines, electronic-grade isopropyl alcohol is used in automatic understencil wipe modules and in offline misprint cleaning. In understencil wipe, a lint-free fabric is wetted with the solvent and passed under the stencil while the printer maintains a preset vacuum to lift paste from apertures. The consistency of the wipe depends more on the saturation level of the fabric than on the solvent’s chemical composition; a dry wipe leaves compacted paste in fine-pitch apertures below 0.3 mm pitch, while an oversaturated wipe transfers excess solvent to the board side and dissolves paste flux at aperture walls, causing slump. Offline misprint cleaning uses spray or immersion followed by soft brush action; stencil foils with electroformed aperture walls tolerate the solvent without coating delamination, but laser-cut stencil surfaces require pre-testing to verify that the emulsified flux does not attack the stencil tension adhesive. Fire safety during stencil cleaning is a production-line constraint because the solvent’s closed-cup flash point is about 12 °C; manual wipe stations require local exhaust and grounded containers. Understencil wipe solvent consumption varies with print speed, stencil aperture density, and paste type; published data for specific paste formulations is limited, and the user generally establishes the replacement interval by inspecting print yield and solder paste viscosity stability rather than by fixed solvent volume.
For lidless processor and power module rework, electronic-grade isopropyl alcohol is used to remove spent thermal interface material from silicon edges, capacitor lands, and nickel-plated heat spreaders before new die-attach or new interface material application. The solvent is saturated onto cleanroom-grade polyester or nonwoven wipers, and the surface is wiped in a single direction to prevent particle redeposition in the gap between die and package substrate. Isopropyl alcohol does not fully dissolve cured silicone or epoxy-based thermal interface compounds, but it wets the filler-oil interface and lowers adhesion enough that the residue can be removed without damaging exposed wire bonds. Optical inspection of the cleaned area uses dark-field microscopy; residues from the solvent itself are specified as non-volatile residue below supplier certificate limits, because any remaining film increases the bond line thickness after new material application and reduces thermal conductivity. In power module lines, the process is performed under local exhaust and with ESD-safe wipers because the solvent is flammable and the assembly can hold residual charge from prior test operations. A common failure mode occurs when operators use cotton-based wipers that shed fibers into the die-edge region; production facilities therefore qualify wiper lots by particle count and fiber release before adding the solvent to the cleaning station. Published data for specific thermal interface material formulations is limited, so the cleaning endpoint is determined by contact-angle uniformity and dark-field inspection rather than by solvent volume alone.
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Xilong Scientific Co., Ltd. supplies isopropyl alcohol electronic grade as a controlled-impurity solvent for semiconductor substrate cleaning, display-panel surface preparation, photomask handling, precision optical component wiping, and printed circuit assembly defluxing. The material is not defined by a single universal model number; commercial identification uses the supplier’s product code for isopropyl alcohol electronic grade, the lot number on the certificate of analysis, and the packaging volume. Typical packing configurations include 500 mL, 1 L, 2.5 L, 5 L, 25 L, and 200 L containers with fluoropolymer or high-density polyethylene contact surfaces. Procurement specifications for electronic-grade IPA usually require assay by gas chromatography of ≥99.8%, water by Karl Fischer titration of ≤0.10%, and residue after evaporation of ≤10 ppm; trace cation and anion limits are set by lot-specific certificate and by SEMI C21-aligned criteria.
Documentation for the product normally includes a lot-specific certificate of analysis, a GHS-compliant safety datasheet, and may include compliance statements for REACH, RoHS, and regional chemical inventory registration. The material is not intended for food, drug, or cosmetic contact unless the user verifies pharmacopeial or food-grade status for the specific grade. Because supplier part numbers and packaging configurations vary through distribution channels, purchasing documents should match the certificate and physical container label before release to cleanroom stockrooms.
The key differences are not only assay but mobile ion content, particle counts, and moisture stability after opening. Isopropyl alcohol has a density of 0.785 g/cm³ at 20 °C, viscosity of 2.3 mPa·s, surface tension of 21.7 mN/m, vapor pressure of 4.4 kPa at 20 °C, refractive index of 1.377 at 20 °C, dielectric constant of 18.3 at 25 °C, and closed-cup flash point near 12 °C. These properties are common to all grades; the electronic grade differs in the trace impurity envelope. In wafer cleaning, mobile sodium or potassium left by solvent drying can lower the threshold voltage stability of MOSFET devices. Electronic-grade material is specified to reduce individual alkali and alkaline earth metals to low parts-per-billion values; reagent ACS-grade IPA typically controls residue after evaporation but does not routinely specify per-element metal contamination. Technical-grade IPA, often used for thinning paints or general degreasing, can carry 0.3–0.5% water, higher residue, and container-derived leachables that are incompatible with projection lithography and wire bonding.
On single-wafer spin processors dispensing IPA through 0.05 µm point-of-use filters, the lower particle burden reduces filter loading and prevents drying marks on blanket oxide and low-k dielectric surfaces. A typical rinse sequence uses ultrapure water followed by electronic-grade IPA dispensed at 0.6–1.2 L/min and spin-off at 1,500–2,500 rpm for 30–60 s. The Marangoni effect of IPA vapor drying is employed on some advanced tools where surface tension gradients withdraw water from high-aspect-ratio features; in this configuration, water content above 0.10% can reduce the drying margin and leave residual water in narrow structures. Published data for Xilong Scientific material in Marangoni drying under production conditions is limited, so the user must verify water content and trace metal levels at the dispense nozzle after chemical delivery line conditioning.
Particle counts and extractables from the packaging are equally important. Cleanroom packaging for electronic-grade IPA usually uses fluoropolymer-lined closures and washed high-density polyethylene or internally coated steel drums. Point-of-use dispense systems add their own particle burden through valves, fittings, and dead legs; therefore, the container certificate is not a direct measurement of particle performance at the wafer or substrate. Production lines that require tight particle budgets install 0.05 µm or 0.1 µm polytetrafluoroethylene membrane filters immediately upstream of the dispense nozzle.
In Karl Fischer volumetric titrations, electronic-grade IPA can serve as a working medium only after the background water content has been measured because residual water in the solvent biases the result. The same moisture sensitivity affects cleaning baths: open-container storage at 23 °C and 60% RH can increase water content within hours. Lot-to-lot variance in trace metal background is observable after container-washing and transport cycles, so at least three lots should be evaluated for water, residue, and per-element metals before release for critical cleaning.
For defluxing of type 3 and type 4 solder paste residues, electronic-grade IPA is applied in spray-in-air stencil cleaners and inline final-rinse modules. The solvent dissolves rosin and many no-clean flux residues, but highly cross-linked no-clean residues may require a saponifier prewash; without this pre-stage, dissolved rosin can redeposit as white residue on fine-pitch leads when bath loading exceeds approximately 15–20% solids. Final rinse with clean electronic-grade IPA maintains ionic contamination values below 1.56 µg/cm² NaCl equivalent as measured by IPC-TM-650 2.3.25; higher-residue technical IPA can fail this limit because chloride and non-volatile organic material remain after drying. In stencil cleaners, the solvent is compatible with stainless steel, PTFE, and polyacetal components, but nitrile and natural-rubber seals swell after repeated exposure and should be replaced with fluoroelastomer or PTFE-enveloped seals. Use in ultrasonic tanks above 45 °C requires local exhaust ventilation and automatic high-temperature shutdown because the closed-cup flash point is near 12 °C and vapor concentration can approach the lower flammable limit.
On high-reliability printed board assemblies, post-clean ionic contamination is checked by dynamic extraction. A final rinse reading above 2.0 µg/cm² NaCl equivalent indicates insufficient rinse volume or contaminated solvent, and the bath should be changed rather than extending rinse time with spent electronic-grade IPA. Spray pressure from 0.3–0.5 MPa at 20–25 °C removes residues under low-standoff components; higher temperatures reduce wetting time by increasing evaporation before capillary penetration.
The following matrix compares typical acceptance profiles. Values are drawn from published compendial, SEMI, and industrial specification ranges; Xilong lot-specific certificates may be tighter or differ for selected metals.
| Parameter | Electronic grade | ACS/Reagent | Technical |
|---|---|---|---|
| Assay by GC | ≥99.8% | ≥99.5% | ≥98.5% |
| Water | ≤0.10% | ≤0.20% | ≤0.50% |
| Residue after evaporation | ≤10 ppm | ≤20 ppm | ≤100 ppm |
| Individual alkali/alkaline earth metals | ≤10 ppb typical | not routinely specified | not routinely specified |
| Chloride | ≤0.2 ppm typical | ≤1 ppm | not routinely specified |
| Application fit | semiconductor and precision cleaning | analytical and laboratory use | thinning and general degreasing |
Vapor degreasing with electronic-grade IPA is limited by the solvent’s boiling point of 82.5 °C and the isopropanol–water azeotrope at 87.9 wt% isopropanol boiling at 80.4 °C. If water content in the sump rises above the azeotropic composition, the vapor phase becomes water-rich and can leave drying spots on cleaned substrates. In production vapor degreasers with immersion and vapor zones, electronic-grade material is charged into stainless-steel or PTFE-lined sumps, and moisture is controlled by a water separator or by using fresh solvent in the rinse sump. The solvent is suitable for cleaning solder flux from assemblies with low heat capacity, but high-residue technical IPA introduces non-volatile residue that accumulates in the sump and deposits on heater surfaces. A recognized failure mode is the formation of white haze on glass-to-metal seals when the final vapor rinse uses solvent with residue above 20 ppm; this is managed by switching the final rinse to electronic-grade material and adding a 0.2 µm recirculating filter.
Storage and incompatibility constraints govern whether the product can be used as a drop-in replacement. Isopropyl alcohol is hygroscopic; an open container held at 23 °C and 60% RH can absorb atmospheric water within hours, raising water content to process-relevant levels. Sealed original containers with dry nitrogen blanketing and PTFE-lined stainless steel or HDPE transfer lines reduce moisture ingress. Monitoring by Karl Fischer titration according to ASTM E203 is appropriate when a process requires ≤0.05% water at the point of use. The material should not be combined with strong oxidizing acids, such as concentrated sulfuric acid/nitric acid mixtures, because exothermic reactions can produce acetone and volatile organic acids. Peroxide formation is possible if the solvent is exposed to air, ultraviolet light, or heat for prolonged periods; therefore, electronic-grade IPA should not be distilled to dryness in unmonitored laboratory glassware. Wetted materials should be 316L stainless steel, PTFE, PVDF, or high-density polyethylene; aluminum and copper distribution components are not recommended for long-term service because metal leaching can contaminate the solvent.
Replacing a competitor electronic-grade IPA or a lower-grade material is not solely a certificate substitution exercise. The qualification should include a rinse study on the actual tool, because container liner and cap materials vary among suppliers and can release trace organic additives not captured by standard assay. Electronic-grade IPA from Xilong Scientific is intended to align with SEMI C21-type impurity expectations, but some advanced packaging operations require more stringent particle counts and metal limits than standard electronic grade; in those cases, lot-specific data and point-of-use filtration are required. For printed circuit assembly, the product is used in final rinse modules and stencil cleaning where low residue and low halide levels reduce electrochemical migration risk after soldering. For display and optical applications, the controlled water content reduces mottling on indium tin oxide films and glass surfaces when combined with cleanroom wipers; however, wiping process cleanliness is governed as much by wiper fiber generation and operator technique as by solvent purity. Published data for Xilong Scientific isopropyl alcohol electronic grade in extreme-ultraviolet photomask cleaning or advanced-node single-wafer tools is limited; these applications require direct qualification with the supplier’s current certificate of analysis and the end-user’s contamination specifications.
