| HS Code | 381769 |
| Assay | >= 99.9% (GC) |
| Appearance | Clear colorless liquid |
| Color | APHA <= 10 |
| Water Content | <= 0.1% (Karl Fischer) |
| Specific Gravity | 0.786 (20/20°C) |
| Boiling Point | 82.4°C |
| Melting Point | -89.5°C |
| Flash Point | 12°C (closed cup) |
| Vapor Density | 2.1 (air = 1) |
| Refractive Index | 1.377 |
As an accredited Tokuyama Isopropyl Alcohol Electronic Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaged in clean, nitrogen-sealed 18 L stainless steel drums to preserve Tokuyama electronic-grade isopropyl alcohol purity. |
| Container Loading (20′ FCL) | Load 20′ FCL of Tokuyama Electronic Grade IPA in clean, sealed drums, securely braced, preventing moisture and contamination. |
| Shipping | Ship Tokuyama Isopropyl Alcohol Electronic Grade as UN1219, Isopropanol (Class 3, PG II). Use grounded, sealed drums or IBCs; secure upright. Apply flammable and corrosion labels? Actually no corrosion. Ensure hazmat documentation, emergency response info, and compliance with carrier regulations. Avoid heat, ignition sources, or incompatible materials. |
| Storage | Store Tokuyama Isopropyl Alcohol Electronic Grade in its original, tightly sealed container in a cool, dry, well-ventilated area, away from heat, sparks, open flames, and strong oxidizers. Keep the container grounded during transfer and ensure static-discharge precautions. Avoid direct sunlight and store below recommended temperature to maintain purity and prevent contamination. |
| Shelf Life | Shelf life is typically 3 years when stored unopened in original container, protected from moisture and contamination. |
Within a 300 mm single-wafer cleaning platform operating in an ISO 14644-1:2015 Class 3 minienvironment, Tokuyama Isopropyl Alcohol Electronic Grade is delivered from a pressure-dispense cabinet through a 0.1 µm point-of-use filter to a heated vapour generator. The generator vaporises neat IPA at 100 vol% into a controlled ultrapure nitrogen carrier; no water is intentionally added to the vapour generator reservoir because the function is not solvency but surface-tension-gradient drying after deionised water rinsing. The supply specification is SEMI C18, which sets assay, water, chloride, trace-metal, and non-volatile residue limits used in semiconductor front-end qualification, and the exhaust ducting and solvent cabinet interlocks are installed to SEMI S2. Wafer processing follows the sequence: DI water final rinse at 22 °C to 24 °C, a low-speed drain step at 300 rpm, then exposure to IPA vapour while wafer rotation ramps from 300 rpm to 1,800 rpm; the Marangoni effect from segmented evaporation removes water without pattern collapse in sub-100 nm features. The terminal outputs are patterned logic, DRAM, NAND flash, and power semiconductor wafers. The critical operational boundary is water ingress: drum water above 0.5 wt% usually produces watermark residues, and any nitrogen flow excursion beyond the tool mass-flow controller range can create IPA aerosol carryover that appears as particle adders in laser scanning defect review.
In photolithographic wafer track operations, IPA is not used only as a cleanup solvent; it appears in the edge bead removal solvent mixture because its higher evaporation rate relative to PGMEA shifts the edge-drying front and controls resist edge redeposition on the backside bevel. Track and resist supplier qualification documents typically bound the IPA addition ratio between 10 wt% and 30 wt% in EBR solvent, with the lower limit set by cup and nozzle maintenance cleaning and the upper limit set by the risk of swelling the photoresist edge and producing a jagged clearance line. The EBR dispense is performed on a coater/developer track during the spin-coat hold step at 500 rpm to 1,500 rpm, while the backside wash nozzle uses contemporaneous solvent to remove edge bead and backside contamination before the wafer enters the bake plate. The terminal product after this step is a pre-exposure coated wafer with a clean edge exclusion zone. Industry compliance is anchored to SEMI C18 for electronic-grade IPA purity and SEMI S2 for the solvent exhaust and fire-safety configuration of the coater track. A production-scale failure observed with lower purity IPA in track washes is nozzle orifice deposition of sulphur and chloride residues from non-electronic grades, causing cup aspirator drain fouling and intermittent EBR dispense pressure drift.
Flat panel array glass entering an ITO pre-deposition cleaning line is processed through ultrasonic immersion tanks where Tokuyama Electronic-Grade IPA is blended with ultrapure water at 25 vol% to 40 vol% in the final rinse stage, after a lower-concentration upstream stage at 10 vol% to 20 vol% for particulate removal. The ratio is maintained by automatic density or refractive index dosing rather than fixed volumetric batch make-up because evaporation loss is significant at the 60 °C–70 °C tank temperature, and open-loop make-up produces variable particle removal behaviour. The downstream process consists of cascade overflow ultrasonic cleaning, high-pressure DI water pre-rinse, the IPA final rinse, and air-knife drying using 0.1 µm-filtered compressed nitrogen. The finished goods are TFT-LCD array glass and OLED backplane substrates before ITO sputtering or organic layer deposition. Standards for the cleaning station include SEMI C18 for solvent purity and ISO 14644-1:2015 Class 5 for the transfer zone into the sputter tool. Published panel-fab-specific bath formulation data is limited because the final IPA concentration is usually a confidential process recipe, but the use of electronic-grade IPA is driven by the need to avoid sodium, calcium, and boron residues that can shift transparent electrode performance and produce mura defects in display inspection.
In a batch-format spray-in-air defluxing tool, a working solution of 70 wt% to 80 wt% Tokuyama Isopropyl Alcohol Electronic Grade in deionised water is held at 45 °C and pumped through a manifold of flat-fan nozzles over assemblies with low-standoff ball-grid-array and quad-flat-no-lead packages. The formulation ratio is specific to high-reliability boards; lower IPA content does not reliably dissolve no-clean and rosin-based flux residues trapped under bottom-terminated components, while higher water content introduces humidity-dependent drying risk under large ceramic packages. A subsequent neat-IPA rinse at 99 wt% or higher and 30 °C removes polar residues left by the water-containing first stage. Process control is verified by resistivity of solvent extract on the production line according to IPC-TM-650 2.3.25, with an acceptance ceiling of 1.56 µg NaCl equivalent/cm² for class 3 hardware under IPC J-STD-001. The terminal product is a cleaned printed board assembly destined for engine-control, avionics, or medical electronics conformal coating. The solvent purification standard is SEMI C18, not a general laboratory grade, to prevent alkali-metal and chloride residues that create leakage currents after humidity testing. Operational limits include solvent-liquid exposure time: immersion or heavy spray beyond 5 minutes on bare copper or OSP copper finishes is avoided because the water/alcohol blend can attack oxide layers and acidify the bath through dissolved flux by-products.
Fiber optic connector end-face cleaning in automated reel-to-reel cassettes uses undiluted 99.5 wt% Tokuyama Isopropyl Alcohol Electronic Grade as the designated wetting agent on low-lint polymer wipes. The cassette head presses the wetted wipe against the ferrule end face under closed-loop force control and advances fresh wipe material for each connector; IPA evaporates at 23 °C before the automated inspection camera captures the end face. The solvent is not diluted in this application because water can create silica haze residues on polished glass and can initiate corrosion on metal alignment sleeves in dense multi-fiber backplane housings. The downstream production process includes cassette wipe advancement, contact-force verification, fan-assisted drying, and automated interferometric inspection with blockage and scratch detection according to IEC 61300-3-35. The terminal products are single-mode and multi-mode optical connectors, transceiver optical sub-assemblies, and multi-fiber backplane ferrules for data-centre and telecommunications equipment. The authority documents for the process are IEC 61300-3-35 for end-face quality acceptance, GR-326-CORE for connector reliability, and SEMI C18 for IPA residue purity. The main operational boundary is solvent handling near assembled optical adhesives: IPA outgassing from open cassettes can plasticize adhesive films on ribbon fiber assemblies and cause false-fail interferometric fringes during later inspection, so the storage and cleaning zones are physically separated.
During the fabrication of surface-micromachined inertial sensors, a sacrificial-oxide release etch in gaseous HF or vapour HF is followed by water rinsing that is the primary source of capillary-force stiction. In this process, Tokuyama Isopropyl Alcohol Electronic Grade is introduced as the bridge solvent between the water rinse and the supercritical CO₂ dryer. The addition ratio is 100% in the solvent-exchange bath; no dilution water is allowed because even the water pulled from the release surfaces can raise the bath water content to failure levels if throughput is not controlled. The exchange sequence uses three sequential immersion baths at 25 °C–30 °C, with point-of-use Karl Fischer titration monitoring water content at the final bath. After the solvent exchange, the wafer cassette is transferred to a supercritical CO₂ drying vessel where the miscible IPA is displaced under pressure-temperature conditions above 31.1 °C and 7.38 MPa. The terminal products are MEMS accelerometers, gyroscopes, pressure sensors, and RF switches in hermetic or near-hermetic chip-scale packages. Standards governing this solvent application include SEMI C18 for electronic-grade IPA purity, ISO 14644-1:2015 Class 5 for the drying and packaging area, and MIL-STD-883 for final component screening where required. The most severe production failure mode is batch-to-batch water escalation: if the second rinse bath is not replaced at the required interval, atmospheric water uptake can exceed 0.5 wt% and produce stiction-related yield loss at probe test.
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Within advanced semiconductor fabrication and flat-panel display lithography, the selection of isopropyl alcohol is governed by trace-cation mobility, particle shedding, and non-volatile residue rather than bulk solvency alone. Tokuyama Isopropyl Alcohol Electronic Grade, CAS 67-63-0, is supplied as a high-purity 2-propanol intended for wafer cleaning, Marangoni drying, optical component rinsing, and flux-residue removal. Distributor literature does not assign a public alphanumeric model code; the product is identified by the electronic-grade designation and the lot-certificate data for metal cations, anions, water content, and particles. Bulk assay is typically specified at 99.99 % or higher for semiconductor-grade IPA, with water controlled to the low ppm range and residue after evaporation kept at or below 5 ppm. Supply formats encountered in semiconductor procurement specifications include 1-L high-density polyethylene bottles, 18-L canisters, and 200-L drums with nitrogen-blanketed closures. Bulk tanker supply is used for high-volume wet benches, but electronic-grade certification is usually maintained only in sealed dedicated tankers because isotainer linings can contribute to metal and leachable contamination. A certificate of analysis typically reports lot number, assay, water content, residue after evaporation, cation panel, anion panel, particle count, and sometimes peroxide concentration. These certificates are generated by ICP-MS, ion chromatography, Karl Fischer coulometry, and laser light obscuration.
The distinguishing parameter set is not bulk purity alone but the maximum allowable concentration of non-target metal ions and sub-0.2 μm particles. ACS reagent-grade 2-propanol is controlled for general laboratory residue and water; electronic-grade solvent is additionally constrained by SEMI C41 and by fab-specific specifications for sodium, potassium, aluminum, iron, copper, chloride, sulfate, and nitrate. Liquid chromatography and ICP-MS analysis after preconcentration are used to report elements at ppt to low ppb levels. In contrast, ACS monograph values may permit residue after evaporation up to 5 ppm and water up to 0.2 %, which is 2,000 ppm. For a 300 mm wafer cleaner consuming several liters per cycle, this difference can deposit measurable cation load on gate oxide surfaces. The table below summarizes a representative comparative envelope; it is not a substitute for the lot-specific certificate of analysis.
| Parameter | Method | Electronic-grade acceptance envelope | ACS reagent grade | Technical grade |
|---|---|---|---|---|
| Assay | ASTM D770 | ≥ 99.99 % | ≥ 99.5 % | ≥ 99 % variable |
| Water | ASTM E203 | ≤ 100 ppm | ≤ 0.2 % | ≤ 0.5 % |
| Residue after evaporation | ASTM D1353 | ≤ 5 ppm | ≤ 5 ppm | ≤ 50 ppm |
| Critical metals | ICP-MS / SEMI C41 | low ppb to ppt | not routinely guaranteed | not controlled |
| Particles ≥ 0.2 μm | SEMI C41 laser count | 10 particles/mL typical maximum | not specified | not specified |
On a high-aspect-ratio spin-rinse-dry wafer track, the replacement of a water rinse with IPA is not merely a solvent substitution. Pattern collapse in sub-20 nm feature classes occurs when the capillary force of evaporating water exceeds the mechanical strength of high-aspect-ratio resist or silicon features. Water at 25 °C has surface tension of approximately 72.8 mN/m, whereas 2-propanol is approximately 21.7 mN/m. In Marangoni drying, IPA vapor contacts the water meniscus at the wafer surface; the surface tension gradient pulls the meniscus toward the bulk liquid and reduces residual water droplets. Equipment typically used includes single-wafer spin processors with IPA vapor injection, isopropyl alcohol vapor dryers, and immersion tanks with slow withdrawal speeds. Production-scale behavior depends on maintaining the IPA water content below the lot limit: water accumulating above 100 ppm raises the effective surface tension and degrades drying on sub-10 nm structures. Field data from 300 mm wafer cleaning tracks indicate that point-of-use filtration through 0.05 μm PTFE membrane cartridges is required to avoid particle adders, and that recirculation loops must use stainless steel or PTFE-lined components to prevent iron contamination. Withdrawal speed in immersion Marangoni dryers is often limited to 2–10 mm/s depending on feature aspect ratio; exceeding the critical receding meniscus velocity can cause carry-over of water microdroplets. IPA vapor concentration at the drying meniscus is controlled by nitrogen carrier flow and bath temperature, and a common fault is overcooling of the vapor nozzle, which condenses solvent onto the chamber wall and causes particle contamination. In a single-wafer spin-rinse-dry tool, the IPA flow is typically injected at the center and the spin speed is ramped to 800–3,000 rpm. Published data for this specific Tokuyama grade in 3D NAND high-aspect-ratio drying is limited; the operational boundary for use should be established by wafer-film adhesion energy and rinse-dry tool geometry.
Electronics assembly cleaning can use electronic-grade IPA for rosin-based and no-clean flux residues, but the solvent is not a direct substitute for NMP in every dissolution profile. NMP is a stronger aprotic dipolar solvent for certain polyimide precursors and high-molecular-weight flux polymers; IPA evaporation before complete solvation can leave white residues on fine-pitch quad flat packages. Under ultrasonic immersion cleaning at 40 kHz, IPA’s relatively high vapor pressure and low flash point require explosion-proof equipment and vapor recovery, while its polar hydroxyl group provides effective removal of ionic halide residues but weaker attack on heavily cross-linked flux films. When replacing NMP, the process window should be redesigned around substrate compatibility, because IPA can swell some acrylic adhesives and polycarbonate enclosures. In printed circuit board cleaning lines, the use of heated IPA baths above 35 °C is generally avoided because vapor concentration can approach the lower explosion limit more rapidly; closed-loop distillation is standard for high-volume lines. Batch-to-batch variation in electronic-grade IPA is controlled for metal content, but it does not fundamentally alter the solubility parameter mismatch for NMP-specific residues. Use of this product in such applications is therefore limited to flux chemistries whose Hansen solubility parameters are matched to 2-propanol, and published data for specific paste-flux combinations using the Tokuyama grade is limited.
Storage of electronic-grade IPA in semiconductor facilities is governed by flammability and contamination control, not by simple shelf life. The product should be stored in a chemically segregated, explosion-proof cabinet or solvent room with nitrogen blanketing on partially used containers to limit atmospheric moisture uptake. Because the material is miscible with water, open-top drums absorb humidity rapidly; at relative humidity above 60 %, transfer should use dried nitrogen or desiccant-filtered air to hold water below the certified range. Incompatibilities include strong oxidizing agents, strong acids, and reactive metals, which can generate peroxides or initiate runaway exotherms under confinement. Peroxide formation in stored IPA is slower than in ethers but can occur after prolonged contact with air and light; semiconductor-grade handling commonly includes a peroxide test strip or spectrophotometric check after 12 months of opened storage. Transfer piping should avoid copper and copper alloys because trace metal dissolution can invalidate the metal-ion specification.
High-purity solvent delivery from 200-L drums into wafer-cleaning tools requires a controlled dispensing chain because the certificate of analysis does not guarantee point-of-use cleanliness after transfer. Semiconductor fabs commonly require sub-10 ppb critical metal content for sodium, potassium, iron, copper, and aluminum, with advanced devices demanding sub-1 ppb or ppt reporting limits aligned with SEMI C41 and fab incoming quality control specifications. Semiconductor-grade IPA lots are sampled and released using ICP-MS, ion chromatography, and laser particle counters. Table 2 outlines a compliance checklist for incoming quality control and dispensing.
| Parameter | Test method | Typical acceptance | Handling note |
|---|---|---|---|
| Metal cations | ICP-MS after preconcentration | ≤ 10 ppb each; sub-1 ppb for critical nodes | Use PTFE sample bottles |
| Anions | Ion chromatography | ≤ 10 ppb each | Avoid glassware leaching |
| Water | ASTM E203 | ≤ 100 ppm | Karl Fischer coulometer |
| Residue after evaporation | ASTM D1353 | ≤ 5 ppm | Platinum dish |
| Particles ≥ 0.2 μm | SEMI C41 laser count | 10/mL typical maximum | Point-of-use 0.05 μm filter |
On manufacturing lines, a frequent failure mode is cross-contamination when the drum pump and hose are not dedicated to high-purity solvents. An iron-containing carbon-steel pump head can release enough iron to exceed a 10 ppb limit within the first liters of dispense. For that reason, PTFE or stainless-steel pumps with PTFE diaphragms are used, and the dispensing line is flushed with product before collecting the point-of-use sample. Drum lot changeover can introduce batch-to-batch variance in trace water and light-end impurities; incoming lots are therefore qualified by stripping analysis or by process validation wafers before use in gate-critical cleaning. Where fab specifications require ppt reporting, published certificate data for this specific product is limited and should be requested from the supplier for each drum.
Photomask cleaning and flat-panel display processing constitute a second use class for the product, where low particle shedding and low residue are more important than solvency alone. In photomask cleaning tools, final rinse with electronic-grade IPA reduces water spots on quartz substrates and minimizes residue that would otherwise generate printable defects. The same grade is used as a rinse after piranha or SC-1 cleaning, provided the tool is fully rinsed with deionized water before IPA enters the chamber to avoid exothermic mixing with strong oxidizers. This operational boundary is frequently overlooked: if IPA is introduced into a chamber containing residual hydrogen peroxide, the resulting vapor can create a flammable mixture. Published data for this specific grade in photomask defectivity trials is limited; acceptance should be based on defect counts, contact angle, and residue testing after the final rinse.
