| HS Code | 774495 |
| Product Name | Merck Isopropyl Alcohol Electronic Grade |
| Chemical Name | Isopropyl alcohol |
| Cas Number | 67-63-0 |
| Molecular Formula | C3H8O |
| Molecular Weight | 60.10 g/mol |
| Purity | ≥99.9% |
| Grade | Electronic Grade |
| Appearance | Clear colorless liquid |
| Water Content | ≤0.01% |
| Density | 0.785 g/cm3 at 20°C |
| Boiling Point | 82.5°C |
| Flash Point | 12°C (closed cup) |
| Refractive Index | 1.377 at 20°C |
| Residue After Evaporation | ≤5 ppm |
| Solubility In Water | Miscible |
| Vapor Pressure | 4.4 kPa at 20°C |
As an accredited Merck Isopropyl Alcohol Electronic Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaging: 1 L bottle of Merck Isopropyl Alcohol Electronic Grade, securely sealed with clear labeling and safety information. |
| Container Loading (20′ FCL) | One 20-foot FCL container loaded with Merck Isopropyl Alcohol Electronic Grade, securely packed and sealed for safe transport. |
| Shipping | Merck Isopropyl Alcohol Electronic Grade ships as a flammable liquid under UN1219, Hazard Class 3, PG II. It must be transported in grounded, properly labeled containers, away from ignition sources. Use approved packaging and comply with IATA/IMDG/ADR regulations for safe handling and delivery. |
| Storage | Store in a tightly sealed, original container in a cool, dry, well-ventilated area away from direct sunlight, heat, and ignition sources. Keep separated from oxidizers. Use approved, grounded containers and explosion-proof equipment. Maintain a clean environment to prevent contamination, and avoid moisture uptake. Keep storage area properly labeled and accessible. |
| Shelf Life | Shelf life is typically 3 years when stored unopened in original container, kept tightly sealed, cool, dry, and away from ignition sources. |
In 300 mm front-end-of-line semiconductor processing, Merck Isopropyl Alcohol Electronic Grade is used as a final surface conditioning solvent after SC-1 and SC-2 wet cleans and before thermal oxidation, furnace deposition, or salicide formation. The solvent is supplied as 2-propanol, CAS 67-63-0, and is not diluted for final dehydration; it is dispensed from a 200 L stainless steel pressure vessel through a PTFE point-of-use filter at 0.05 µm and a stainless steel dispense manifold held at 20–25 °C and 0.1–0.3 MPa. In the particle-removal stage, the cleaning bath is operated with 80–90% ultrapure water and 10–20% electronic-grade IPA; megasonic energy is applied at 400 kHz to 1 MHz to displace sub-0.12 µm particles from high-aspect-ratio structures. Final drying in a Marangoni single-wafer dryer uses a nitrogen carrier flow of 0.5–1.0 L/min per wafer and an IPA vapor concentration of 2–4 vol% at the air-liquid meniscus. Two process boundary conditions control qualification: water content above 0.1% w/w creates watermark streaks on HF-last hydrophobic silicon, and non-volatile residue above 5 mg/kg creates haze after rapid thermal oxidation at 1,000 °C. Lot-to-lot monitoring on a 300 mm line typically records non-volatile residue between 1 mg/kg and 3 mg/kg; excursions are traced to pump seal wear in chemical distribution lines. The finished wafer is transferred with a front-side particle adder specification of not more than 20 particles per wafer at ≥0.12 µm, measured by a calibrated surface particle scanner. The product must conform to electronic-grade solvent limits in SEMI C18; the inlet air of the dispense cabinet is maintained at ISO 14644-1 Class 3 to avoid airborne residue transfer.
Spin-coater lithography cells dispense Merck Isopropyl Alcohol Electronic Grade as a neat edge bead removal solvent through a dedicated dispense nozzle positioned 0.5–1.0 mm from the wafer bevel. The wafer is rotated at 1,200–1,800 rpm for the first 5 s and 2,000–2,500 rpm for the final dry interval; dispense volume is 0.8–1.5 mL per 200 mm wafer edge. The liquid is not blended with water because water content above 0.1% can swell 193 nm chemically amplified resists outside the intended removal zone. On porous organosilicate low-k films with dielectric constant below 2.5, the surface tension of IPA, approximately 23 mN/m at 20 °C, is low enough to wet the bevel but high enough to reduce capillary pore collapse relative to lower-tension fluorinated solvents; qualification on blanket low-k coupons is still required because published data for this specific configuration is limited. A process conflict occurs when static charge accumulates on hydrophobic resist sidewalls, causing re-deposition of dissolved resist fragments; this is suppressed by grounding stainless steel dispense lines and using 0.1 µm PTFE filter housings. Dark-field inspection at 50x magnification verifies a clean bevel and an edge exclusion zone of 3 mm on the device side. Dispense volume below 1.0 mL may leave a continuous organic skin, while volume above 2.5 mL can penetrate along the wafer edge and delaminate bulk resist. Material lot release follows SEMI C18 limits; chloride content below 1 mg/kg is required to prevent copper line corrosion after low-k etch. The terminal product is a patterned resist layer on a low-k dielectric stack with the bevel and backside free of resist residue before gate or contact etch.
Under-stencil wipe modules on surface-mount assembly lines introduce Merck Isopropyl Alcohol Electronic Grade into SAC305 no-clean solder paste printing with Type 4 or Type 5 powder. A typical stencil cleaning cycle pre-saturates a 300 mm × 300 mm low-lint nonwoven wipe with 6–10 mL of solvent and wipes the aperture underside for 0.5–2.0 s at a vacuum platen pressure of −0.8 bar. The solvent is used without dilution; moisture above 0.2% can initiate slump in exposed solder paste at 25 °C and 50% RH. For aperture dimensions below 0.25 mm and area ratios below 0.66, recirculating ultrasonic stencil cleaners with 28 kHz transducers and 40 °C tank temperature improve paste removal from aperture sidewalls. The cleaning tool is fitted with a coalescer and activated carbon vent to keep solvent vapor below 25% of the lower flammable limit; the enclosure is electrically bonded to prevent static ignition. After solvent exposure, the stencil is blown with particle-filtered compressed air at 0.4 MPa until no visible film remains. Halogenated or metallic residues from non-electronic-grade solvent can reduce surface insulation resistance; production qualification therefore uses IPC-B-24 coupons tested according to IPC-TM-650 method 2.6.3.3. The operational boundary is that step stencils with epoxy dam adhesive should not be immersed in the solvent for more than 60 min; beyond this point, adhesive softening allows paste flow under step bridges. The finished assembly is a printed circuit board with solder paste deposits confined to the aperture pattern and no bridging after reflow, meeting J-STD-001 workmanship criteria.
Cassette-based fiber optic cleaning tools apply Merck Isopropyl Alcohol Electronic Grade to single-mode and multimode connector end faces. The cleaning cycle dispenses 0.05–0.10 mL per connector end face through a 0.8 mm polyester or microfiber wiping strip, followed by a 5 s drying interval under filtered nitrogen at 2 L/min and inspection with a 200× digital end-face microscope. Cleanliness is classified according to IEC 61300-3-35; for single-mode UPC connectors, the core and cladding adhesion zones are inspected for non-removable debris, while the contact zone permits limited lint particles. The solvent is used neat and is prefiltered at 0.2 µm upstream of the dispense nozzle because particles larger than 0.5 µm can be re-deposited as the liquid evaporates. In 10 GB/s transceiver assembly, a cleaned ferrule must show no adhesion-related defect transfer to the final optical transceiver test; insertion loss below 0.5 dB and return loss above 50 dB are typical acceptance values. The material is not applied to connectors containing refractive-index-matching gel or to expanded-beam lens contacts because IPA extracts the gel and can shift optical return loss. The terminal product is a polished ceramic ferrule end face that passes automated end-face inspection before splicing or component insertion.
During rework of high-performance computing assemblies, Merck Isopropyl Alcohol Electronic Grade is used to remove cured silicone-based thermal interface material from nickel-plated copper heat spreaders, anodized aluminum heatsinks, and ceramic package lids. On a production rework station, a continuous-reel wipe dispenser delivers 3–5 mL per 100 cm² of contaminated surface at 20–25 °C. For softened thermal pad residues, a dwell time of 15–20 min under an IPA-saturated lid is sufficient; for fully cured silicone paste, mechanical agitation with a nylon brush at 60–80 cycles/min is required to break the crosslinked surface. The liquid is used neat; dilution with water is not specified because water slows the evaporation rate and can leave a visible film on low-surface-energy thermal pad fragments. Cleaned metal surfaces are checked by FTIR-ATR; the absence of the silicone Si-CH₃ deformation band near 1,260 cm⁻¹ is used as a production-pass indicator, with spectral interpretation following ASTM E1252. The solvent must not dwell on polyimide stiffener adhesives or acrylic pressure-sensitive tape for more than 60 s; solvent uptake above 2 wt% causes dimensional swelling and reduces peel strength. The finished surface is a dry heat spreader or heatsink base prepared for new thermal interface material deposition, without measurable TIM residue by FTIR-ATR or total organic carbon swab analysis.
A linear cleaner equipped with a 3 mm slot nozzle applies Merck Isopropyl Alcohol Electronic Grade to 6th-generation LCD glass substrates before polarizer lamination. The liquid is dispensed through 0.1 µm PTFE hollow-fiber filters at 0.2–0.4 L/min per 1,500 mm substrate, with substrate temperature held at 25–35 °C. Rinse zone exposure time is 8–12 s, immediately followed by a clean dry air knife at 0.4 MPa and 30–40 °C to prevent evaporative streaking. The solvent is used neat; any non-volatile residue above 5 mg/kg can deposit in the gap between the glass and polarizer and create visible mura after lamination. Water content above 0.1% extends the time required to reach a water contact angle below 10°, which is used as lamination readiness on the color filter surface. The process boundary at the top edge of the glass is defined by the driver IC pad area: IPA spray reaching the pad region must be removed before chip-on-film bonding because residual solvent can be trapped under anisotropic conductive film and reduce adhesion during thermocompression bonding. The terminal product is a clean glass cell with uniform surface energy for pressure-sensitive polarizer film attachment and no mura-inducing particle pattern in transmitted light inspection.
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Merck Isopropyl Alcohol Electronic Grade is 2-propanol (CAS 67-63-0) qualified for contamination-sensitive wet processing in microelectronics, optoelectronics, and precision optics. The commercial designation serves as the model identifier within the Merck electronic chemical portfolio; purchase orders differentiate container size, dispense configuration, and cleanroom packaging rather than separate chemical grades. The material is supplied as a colorless, low-viscosity solvent with density 0.785 g/cm³ at 20 °C per ASTM D4052, boiling point 82.3 °C at 101.3 kPa, dynamic viscosity 2.04 mPa·s at 25 °C per ASTM D445, surface tension 21.7 mN/m at 20 °C, closed-cup flash point 11.7 °C per ISO 2719, and vapor pressure 4.4 kPa at 20 °C. These physical constants are common to electronic, ACS, and technical grades; the electronic-grade qualification resides in the controlled water content, nonvolatile residue, ionic contamination, trace metal burden, and particle population. The solvent is filtered at 0.1 µm prior to packaging and filled into cleanroom-compatible glass or fluoropolymer-lined containers under nitrogen overlay to limit water uptake and airborne particulate ingress.
Acceptance is not established by chromatographic assay alone. The certificate-of-analysis matrix applied to the Merck electronic-grade product family includes water, nonvolatile residue, chloride, sulfate, trace metals, and submicron particles. Representative limits are shown in Table 1; actual lot values are reported against these limits in each certificate of analysis. Water is determined by coulometric Karl Fischer titration under ASTM E1064, which provides limit-of-detection capability below 10 µg/g when the titration cell is isolated from atmospheric moisture. Nonvolatile residue is measured by ASTM D1353 after solvent evaporation in a tared vessel. Trace metals are determined by inductively coupled plasma mass spectrometry after solvent evaporation to concentrate involatile inorganic species; chloride and sulfate are measured by ion chromatography using matrix-matched standards because aqueous environmental methods are not directly applicable to high-purity nonaqueous solvents.
| Parameter | Test method | Specification limit |
|---|---|---|
| Assay, as 2-propanol | GC-FID area normalization | ≥99.8% |
| Water | ASTM E1064 | ≤200 mg/kg |
| Nonvolatile residue | ASTM D1353 | ≤2 mg/kg |
| Chloride | Ion chromatography | ≤0.1 mg/kg |
| Sulfate | Ion chromatography | ≤0.2 mg/kg |
| Total trace metals | ICP-MS after evaporation | ≤50 µg/kg |
| Individual Na, K, Ca, Fe | ICP-MS | ≤10 µg/kg each |
| Particle count, ≥0.2 µm | Laser particle counter | ≤25 particles/mL |
In front-end semiconductor drying sequences, the solvent is introduced after a deionized water rinse in spin-rinse dryers or immersion wet benches. The electronic-grade isopropyl alcohol acts as a water-miscible drying medium that lowers the surface tension of the leaving liquid film and thereby limits capillary meniscus forces on high-aspect-ratio photoresist lines or silicon nanopillars. In Marangoni drying equipment, the solvent is evaporated into a heated nitrogen stream and directed at the meniscus during wafer withdrawal at 1.0–3.0 mm/s; the resulting surface-tension gradient pulls water back into the rinse bath. Water extraction from the wafer surface depends on maintaining low water content in the circulating solvent. Because 2-propanol and water form a minimum-boiling azeotrope at 12.1 wt% water and 80.3 °C at 101.3 kPa, distillation of wet isopropyl alcohol cannot regenerate anhydrous solvent without molecular sieve dehydration or membrane pervaporation. In production wet benches, online conductivity and Karl Fischer sampling monitor water ingress; when bath water approaches 0.5%, drying efficiency degrades and residual water can produce watermarks or hydrated silica residues after metal etch steps. Point-of-use filtration at 0.1 µm removes aggregated particles and dried salts that may precipitate as the solvent evaporates. Published data for specific defect-density improvement in advanced memory-node processes is limited; however, the relationship between low water, low nonvolatile residue, and reduced post-dry residue is established in semiconductor cleaning practice.
For printed circuit board defluxing after reflow, electronic-grade isopropyl alcohol is applied in spray-in-air systems or ultrasonic immersion at 40–80 kHz. The low nonvolatile residue specification prevents formation of white dendritic deposits when flux activators are dissolved and rinsed from low-standoff ball-grid-array packages. Chloride extraction from rosin and no-clean fluxes is assisted by the solvent’s polar hydroxyl functionality, but the solvent itself must not contribute ionic halide above 0.1 mg/kg chloride. Cleaning trials on production-scale spray systems using high-velocity top and bottom nozzles followed by deionized water rinses and isopropyl alcohol drying show that the chloride-specific limit is more operationally critical than nominal assay for avoiding subsequent electrochemical migration. The solvent is compatible with ceramic, FR-4, polyimide, and solder mask surfaces under short-term immersion, but it is not a replacement for saponified aqueous cleaners on heavily oxidized rosin fluxes. Because the flash point is below 23 °C, vapor accumulation in enclosed spray chambers must be controlled with lower-explosive-limit monitoring and explosion-proof ventilation compliant with NFPA 30 and IEC 60079-10-1 zone classification.
High-purity packaging is a controlling factor in preserving electronic-grade isopropyl alcohol from the point of filling to the wet bench. The Merck electronic-grade product is supplied in borosilicate glass bottles, high-density polyethylene containers, or stainless-steel canisters; bulk containers are nitrogen-blanketed to prevent absorption of atmospheric water and carbon dioxide. Metal extractables from steel canisters are managed through surface passivation and lot qualification. In semiconductor fabs, the solvent is delivered to wet benches by nitrogen pressure dispense at 70–210 kPa through fluoropolymer tubing and 0.1 µm point-of-use filters. Dedicated dispensers prevent cross-contact with photoresist solvents such as propylene glycol methyl ether acetate or methyl isobutyl ketone; transfer through carbon steel or brass fittings is not permitted because iron and copper extractables can exceed the 10 µg/kg individual metal specification. Cleanroom filling is performed in ISO 14644-1 Class 4 zones to limit airborne particle loading. Incoming lot acceptance should include particle counting after container agitation because aggregation can occur during shipment under thermal cycling. Liquid particle counters used for release testing are calibrated under ISO 21501-2.
If the application is vapor degreasing of micro-optical components, fiber optic connectors, or laser diode submounts, the electronic grade can be used in closed vapor degreasing equipment with heated sump and chilled freeboard. The low water content is essential because water accumulates in the vapor phase and can condense as microdroplets on substrates, leaving dried silica or salt residues after evaporation. In such equipment, the solvent is heated to 82–83 °C; the vapor zone is maintained with a freeboard chiller below 10 °C to limit emissions. Electronic-grade isopropyl alcohol is a narrow-solvent cleaner effective for nonpolar silicone and hydrocarbon contamination, but it is not suitable for high-molecular-weight waxes or heavily crosslinked photoresist films. No stabilizers are present, which differentiates the product from stabilizer-containing chlorinated or hydrocarbon degreasing solvents. Reactive metals such as aluminum are generally compatible under short contact; however, aggressive halogenated residues can generate acidic species under boiling conditions. The absence of added corrosion inhibitors means that active-metal compatibility must be qualified on production-representative substrates and contaminant mixtures rather than assumed from neat solvent data.
Compared with ACS reagent 2-propanol, the electronic-grade product imposes lower limits for nonvolatile residue, water, and trace ionic impurities. ACS-grade specifications for 2-propanol permit water at 0.2% and residue at 10 mg/kg, which are 10 times higher than the electronic-grade water limit and 5 times higher than the residue limit; technical-grade material often has no definite chloride or trace metal release limit at all. Table 2 summarizes the differentiating parameters across the three common grades. The electronic-grade product is not simply ACS-grade solvent filtered once; it requires controlled feedstock distillation or dehydrogenation, molecular sieve dehydration, and supply-chain segregation from industrial 2-propanol to preserve trace metal and particle purity. The product therefore carries a higher unit cost per liter, but it reduces re-cleaning and defect-related scrap in contamination-sensitive operations. In optical lens and laser diode cleaning, residue below 2 mg/kg prevents hazy films; in semiconductor wafer drying, metal contamination below 10 µg/kg for sodium, potassium, calcium, and iron reduces the risk of threshold voltage drift and dark current increases when pre-diffusion cleans are involved.
| Parameter | Electronic grade | ACS reagent | Technical grade |
|---|---|---|---|
| Assay | ≥99.8% | ≥99.5% | ≥99.0% |
| Water | ≤200 mg/kg | ≤2000 mg/kg | often unstated |
| Nonvolatile residue | ≤2 mg/kg | ≤10 mg/kg | ≤50 mg/kg or unstated |
| Chloride | ≤0.1 mg/kg | ≤0.5 mg/kg | often unstated |
| Trace metals | ≤50 µg/kg total | ≤5 mg/kg residue; metals not specified | not specified |
| Particle control | filtered at 0.1 µm | not specified | not specified |
Electronic-grade isopropyl alcohol should be segregated from concentrated strong oxidizers such as nitric acid, sulfuric acid-peroxide mixtures, and chromium trioxide because exothermic oxidation can occur. In lithography areas, it is used as a rinse and dry solvent after aqueous developer and water rinses, but it is not a stripper for exposed or crosslinked photoresist. Combination with N-methyl-2-pyrrolidone or dimethyl sulfoxide strippers may allow the stripper to absorb water from the isopropyl alcohol and slow removal kinetics. Wetted seals on dispense pumps and valves should be fluoropolymer or high-density polyethylene; nitrile, neoprene, and butyl rubber swell in prolonged contact and can release extractables that violate particle and trace metal specifications. Storage temperature should remain below 35 °C and away from direct sunlight to minimize peroxide formation, because the electronic-grade product is not stabilizer-protected. Containers should be grounded during transfer because isopropyl alcohol has low conductivity and can accumulate static charge. Venting devices should be pressure/vacuum relief with desiccant or nitrogen overlay to avoid moisture uptake. Published data for specific seal material compatibility with low-metal electronic-grade isopropyl alcohol is limited; qualification should use long-duration extraction studies under the specific temperature and ultrasonic energy applied on the production line rather than relying solely on neat solvent exposure data.
