| HS Code | 563391 |
| Chemical Name | Isopropyl Alcohol |
| Chemical Formula | C3H8O |
| Cas Number | 67-63-0 |
| Molecular Weight | 60.10 g/mol |
| Purity | ≥99.9% |
| Water Content | ≤0.05% |
| Appearance | Clear colorless liquid |
| Boiling Point | 82.5°C |
| Melting Point | -89.5°C |
| Flash Point | 11.7°C |
| Density 20 C | 0.786 g/cm³ |
| Refractive Index 20 C | 1.3772 |
| Evaporation Residue | ≤5 ppm |
| Acidity As Ch3cooh | ≤0.0002% |
| Color Apha | ≤5 |
As an accredited Lihuayi Weiyuan Isopropyl Alcohol Electronic Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Lihuayi Weiyuan Electronic Grade Isopropyl Alcohol is packaged in sealed 25L drums, ensuring high purity and safe handling. |
| Container Loading (20′ FCL) | 20′ FCL container loading of Lihuayi Weiyuan Isopropyl Alcohol Electronic Grade, packaged in drums, stowed and secured for safe transport. |
| Shipping | Shipping of Lihuayi Weiyuan Isopropyl Alcohol Electronic Grade requires strict adherence to hazardous material regulations. Use sealed, grounded containers, avoid ignition sources, and ensure proper ventilation. Transport in dedicated vehicles with appropriate labeling, spill containment, and documentation to maintain purity and safety. |
| Storage | Store in tightly sealed, approved containers to maintain electronic-grade purity. Keep in a cool, dry, well-ventilated area away from heat, sparks, flames, and strong oxidizers. Use explosion-proof equipment and ground containers to prevent static discharge. Avoid contamination and moisture; inspect containers regularly for damage or leakage. |
| Shelf Life | Shelf life is 12 months if stored sealed in original container, kept cool, dry, and away from sunlight. |
In 300 mm front-end wet processing, the transition from aqueous cleaning to solvent-assisted drying determines pattern collapse yield loss on dense logic devices. Lihuayi Weiyuan electronic-grade isopropyl alcohol is introduced into single-wafer spin processors after the final deionized-water rinse, where its lower surface tension—approximately 21.6 mN/m at 20 °C—reduces capillary pressure across high-aspect-ratio trenches and via arrays. The wafer rotates at 1,200–1,500 rpm while nitrogen and IPA are dispensed through a point-of-use 0.05 μm filter. The solvent water specification, typically controlled to ≤0.1 wt% by Karl Fischer titration, prevents water spotting on exposed cobalt or tungsten plugs. Metallic impurity control follows SEMI C41-0301, with supplier certificates of analysis routinely reporting per-cation values below 10 ppb for Cu, Fe, Zn, and Cr by ICP-MS. The process window is bounded by the lower flammability limit of 2.0 vol% in air and the 12 °C flash point, requiring exhaust ventilation sufficient to maintain solvent vapor below 25% LEL inside the tool enclosure. Process engineers monitor residual IPA carryover by TOC analysis of the subsequent DI rinse; values above 500 ppb indicate insufficient N2 purge time. The terminal product is the post-plating or post-etch wafer with sub-20 nm gate structures released to physical vapor deposition or atomic layer deposition without water-induced pattern deformation.
The same solvent is used in bevel cleaning modules where residual organic contamination from adhesive tapes is removed without attacking exposed low-k dielectric. In those modules, IPA is delivered through an atomizer at 50–100 mL/min while wafer rotation is held near 800–1,000 rpm. The cleaned bevel is inspected by bright-field microscopy, and dewetting is required to complete within 15 s at 25 °C before the wafer enters the next vacuum chamber.
| Parameter | Control window | Test method |
|---|---|---|
| Assay | ≥99.8 wt% | GC-FID |
| Water | ≤0.1 wt% | Karl Fischer titration |
| Non-volatile residue | ≤5 ppm | ASTM D1353-13 |
| Color APHA | ≤10 | ASTM D1209-05 |
| Cu, Fe, Zn, Cr (each) | <10 ppb | ICP-MS |
Indium-tin-oxide and molybdenum source-drain lines on Gen 8.5 AMOLED backplanes are cleaned before polyimide alignment-layer slot coating. At that stage, organic contamination is controlled to sub-monolayer levels by contact angle and XPS. Lihuayi Weiyuan electronic-grade isopropyl alcohol is blended with deionized water at 50–70 vol% and delivered through fan-spray nozzles in a horizontal cleaning unit. Ultrasonic agitation at 40 kHz and 950 kHz detaches particulate residues larger than 0.5 μm, while the IPA component lowers surface tension and accelerates evaporation from glass edges. The glass is then dried by an air knife with filtered dry air at 0.4–0.6 MPa. ISO 14644-1:2015 Class 5 cleanliness is required at the cleaner exit. Defect inspection by automated optical inspection rejects bright-field defects larger than 3 μm. Residual non-volatile matter from the cleaning solvent is maintained below 5 ppm as measured by ASTM D1353-13, preventing mura-inducing residue on the alignment layer. Incompatibility with freshly deposited photoacrylic films is documented; IPA contact before post-bake can cause microcracking in some acrylate overcoat materials. The cleaning bath is serviced by a vacuum-assisted distillation recovery loop, and recovered IPA is re-analyzed for sodium and potassium by ICP-OES before reuse. The downstream product is the aligned liquid-crystal or organic light-emitting display backplane with a defect density compatible with high-resolution mobile panel yields.
In high-mix PCB assembly, automated stencil printers dispense electronic-grade IPA directly onto the underside of fine-pitch apertures during the cleaning cycle. The solvent dissolves tacky flux residue before it can accumulate in apertures below 0.25 mm pitch. Lihuayi Weiyuan electronic-grade isopropyl alcohol is typically blended with deionized water at 50–80 vol% because anhydrous IPA can evaporate too rapidly from the wipe paper to dissolve dried rosin esters. Proprietary no-clean fluxes with high molecular-weight rosins may require contact time above 15 s, achieved by reducing the printer wipe stroke speed to 40 mm/s. The low non-volatile residue specification, ≤5 ppm, avoids introducing ionic contamination into solder paste that would be detected by surface insulation resistance testing under IPC J-STD-004C. Stencil cleaning units drawing IPA are required to use explosion-proof vacuum systems because the vapor density is heavier than air and the flash point is 12 °C. Cartridge-based fume extraction with activated carbon is set to maintain workplace airborne concentration below 400 ppm as an 8-hour TWA. Wipe paper saturation is maintained at 3–5 mL per cycle but not higher, because excessive solvent can carry flux into apertures and cause insufficient solder brick height. After cleaning, the stencil underside is inspected at 10–20× magnification; aperture blockage larger than 10% of opening width requires manual rework with lint-free swabs. The terminal assembly is a printed circuit board with lead-free solder joints meeting automated optical inspection criteria for zero solder bridges and consistent brick volume.
Before single-mode fusion splicing of 125 µm cladding fiber, the bare glass end-face is cleaned with an optical cassette cleaner charged with electronic-grade isopropyl alcohol. Residual hydrocarbon film as thin as 50 nm can change splice loss by 0.02 dB or more in 1310 nm transmission. The solvent must have non-volatile residue below 5 ppm; otherwise a visible haze remains after the alcohol evaporates. IEC 61300-3-35 end-face inspection defines scratch and defect criteria, and cleaning with electronic-grade IPA is used to remove soluble buffer gel before a dry cleave. The cleaning operation is limited to short contact time, typically 10–20 s, to prevent alcohol creep into the fiber coating. Operators use a fresh section of lint-free wipe for each fiber; re-wetting of a saturated wipe deposits dissolved contaminants back onto the glass. After cleaning, the end-face is inspected at 400× magnification. If a residual film is detected, a second dry polish with a specialty swab is performed rather than additional IPA, because further IPA application raises dewetting streaks on silica. The produced splice is released to the passive optical network segment only after insertion loss and return loss measurements meet the network operator specification.
Selective conformal coating of PCBs with silicone-based coatings requires thinning to a target viscosity of 100–150 cP before application through a needle valve or atomizing nozzle. Lihuayi Weiyuan electronic-grade isopropyl alcohol is added at 5–15 wt% of the coating weight, based on Brookfield viscosity measurements at 25 °C and 20 rpm. The low water content, typically ≤0.1 wt%, is critical because water reacts with moisture-curable silicone systems and can cause premature skinning in pressure pots. Addition of IPA changes the flash point of the mixture; the system is operated inside a ventilated spray booth with continuous VOC monitoring. Coating thickness is measured after cure by eddy-current or cross-sectional microscopy, typically 50–150 µm for silicone conformal coating in harsh environments. The solvent is metered by a peristaltic pump with a 0.2 µm filter to avoid particle generation. IPC-CC-830B testing for hydrolytic stability and insulation resistance is conducted on finished assemblies; residual IPA in uncured coating causes bubbles if the flash-off zone is shorter than 30 s. Published data for this specific formulation configuration is limited; each coating manufacturer provides its own thinning ratio and compatibility matrix. The use of electronic-grade IPA rather than technical-grade is justified by the absence of transition-metal ions that can migrate under SIR testing. The finished assembly is a selectively coated PCB with a conformal insulation film cured to a uniform thickness and qualified for the end-use environmental class.
Thermal interface material residues on flip-chip organic substrates present a voiding risk during solder thermal interface material and copper lid attach. Excess silicone-based TIM is cleaned from the seal ring area with electronic-grade isopropyl alcohol dispensed onto cleanroom swabs. The solvent dissolves uncured silicone without leaving detectable sodium or potassium above 5 ppb, as measured by ion chromatography of swab extracts. Bond-line voiding is correlated with residual TIM thickness above 5 µm, so wipe pressure and swab saturation are controlled: each swab is wetted with 0.5–1.0 mL and used over no more than 10 mm of seal ring length. The cleaned substrate is inspected by X-ray or scanning acoustic microscopy after lid attach; void area less than 5% of the lid area is the acceptance criterion for many automotive packages. Flammability restrictions require point-of-use dispensing from a grounded, pressure-resistant container and local exhaust of 0.5 m/s face velocity. ASTM D1353-13 residue testing of the solvent lot is retained for each production batch. Incompatibility with laser-marked mold compound is documented: IPA can soften ink markings if wiped across already marked units, so cleaning sequence must precede laser mark or use a masked wipe path. The packaged semiconductor device is released to lid attach final inspection with hermetic or near-hermetic seal ring cleanliness and no transferred ionic species that would compromise biased HAST performance.
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Lihuayi Weiyuan Isopropyl Alcohol Electronic Grade is a high-purity 2-propanol supplied for direct use in semiconductor wafer cleaning, drying, and precision solvent applications. The product is identified as CAS 67-63-0, EC number 200-661-7, molecular formula C3H8O, and molecular weight 60.10 g/mol. The material is a clear, colorless, low-viscosity liquid with a closed-cup flash point of approximately 12 °C, a boiling point of 82.4 °C at 101.3 kPa, and vapor pressure near 4.4 kPa at 20 °C. Density at 20 °C is approximately 0.785 g/cm³, viscosity is approximately 2.4 mPa·s, and surface tension is approximately 21.7 mN/m. The electronic-grade designation is not derived from these physical constants but from the specificity of the impurity envelope. The product is intended to conform to the general lot-acceptance framework described in SEMI C8 for isopropyl alcohol, with certificate-of-analysis results for assay, water, nonvolatile residue, acidity, chloride, sulfate, particle burden, and trace elements. Package configurations should be confirmed with the supplier, but typical cleanroom-compatible formats include pre-cleaned glass bottles, fluorinated high-density polyethylene drums, and passivated stainless steel totes. Users should treat the supplier certificate as the only valid source of lot-specific quality data because fill-line moisture ingress and container preparation can shift individual values inside the accepted control band.
The differentiation is concentrated in analytical detection limits rather than in hydrogen-bonding solvency. Commodity isopropanol may be supplied at 99.0 wt% assay or better and still contain water at 0.2–0.5 wt%, residue after evaporation in the 20–100 mg/L range, and uncontrolled levels of sodium, potassium, calcium, magnesium, iron, copper, and zinc. Lihuayi Weiyuan Isopropyl Alcohol Electronic Grade is controlled during distillation, dehydration, and filtration so that water is typically held at or below 0.1 wt% by Karl Fischer titration, and nonvolatile residue is held at or below 10 mg/L by evaporation. Trace-metal specification commonly sets the critical alkali, alkaline-earth, and transition elements at ≤1 µg/L per element by inductively coupled plasma mass spectrometry after preconcentration. Particle control is also absent in most commodity solvent specifications. An electronic-grade lot is delivered with a particle count of ≤100 counts/mL for particles ≥0.2 µm, which is the cleanliness band used in many semiconductor process chemical qualifications. ACS-grade and HPLC-grade IPA are not automatic substitutes because their specifications emphasize laboratory impurity profiles and ultraviolet transparency but do not require the same particle and trace-metal controls, and their containers are not necessarily prepared for cleanroom transfer. The result is that a high-purity laboratory alcohol can still leave ionic residues on a gate oxide, copper interconnect, or display backplane.
Production-scale purification normally consists of a dedicated distillation sequence with dehydration and submicrometre filtration. Isopropanol forms a minimum-boiling azeotrope with water at 87.7 wt% alcohol and 80.4 °C at atmospheric pressure; therefore the drying step must use azeotropic, extractive, or membrane-assisted separation rather than simple distillation. In continuous chemical plant operation, final purity depends on reflux ratio, feed variability, and the cleanliness of transfer piping as much as on the primary column design. Vacuum-distilled material can be recontaminated by non-passivated stainless steel surfaces or by elastomer seals if the fill line is not designed for electronic-grade service. For that reason, technical control of this product extends beyond analytical testing after distillation: the filling environment, container wash procedure, and closure system are all part of the electronic-grade specification. Lihuayi Weiyuan material is therefore not simply industrial isopropanol subjected to a final point-of-use filter; it is supplied with an analytical release profile intended to support incoming quality control in semiconductor fabrication. When a facility qualifies the product, it typically repeats particle counting, forced evaporation on silicon witness wafers, and ion chromatography of the washed extract according to its own process tolerance. These incoming checks are especially important if the drum or tote has been stored unopened for an extended period before use.
In wafer drying after an aqueous rinse, the function of isopropyl alcohol is to lower the surface tension of the residual water film and create a moving liquid front that leaves a low-defect surface. Water remaining inside the IPA phase reduces this surface-tension differential and can leave nonvolatile residue after the alcohol evaporates. Process engineers use this product in spray dryers and vapor dryers where the alcohol is heated to 70–82 °C and introduced through condensation or displacement chambers; the exact recipe temperature is determined by the tool manufacturer and by the water-isopropanol boiling curve. In high-aspect-ratio patterns, small increases in water content and particle count can shift the pattern-collapse margin. The electronic-grade specification therefore imposes tighter control on moisture and particles than the solvent used for benchtop cleaning. Drying performance cannot be assigned to chemical purity alone. Oxygen level in the dryer, alcohol delivery rate, wafer rotation, and exhaust flow all influence carryover defects and final residue. Published comparative data across different electronic-grade IPA sources under identical single-wafer dryer recipes is limited; users therefore implement lot-to-lot verification by measuring particle counts, surface residue, and water content at incoming inspection. The solvent's measured surface tension of approximately 21.7 mN/m at 20 °C supports the displacement mechanism, but the process benefit is realized only when water and particulate contamination remain below the user's defect tolerance.
Electronic-grade isopropyl alcohol is also used in photomask cleaning, precision optics, OLED display fabrication, and removal of organic surface residues before film deposition. In these applications, nonvolatile residue and trace-metal content are often more critical than the bulk assay because high molecular weight oligomers and metal-bearing particles migrate into small geometrical clearances and are difficult to rinse. The certificate of analysis for this product reports acidity as acetic acid in mg/kg units and residue after evaporation in mg/L units; acidic species can corrode copper lines, promote esterification in stored formulated blends, and interfere with optical surfaces. Chloride and sulfate are controlled in the low mg/kg range because they participate in electrochemical migration. The product contains no intentionally added amine corrosion inhibitors or fluorinated surfactant additives, so compatibility with photoresist solvents and fluorinated cleaning agents is determined by flash point, polarity, and moisture partitioning rather than by additive reactions. In flat-panel display processing, alkali-metal contamination must be excluded from thin-film transistor gate dielectrics; incoming inspection may follow SEMI C8 and add internal limits for sodium, potassium, and calcium below the standard product upper band. The material is therefore positioned between commodity solvent isopropanol and more specialized ultra-anhydrous IPA used in sub-10 nm logic and advanced memory. For the latter applications, a low-water option or point-of-use drying gas blanketing may be required because standard electronic-grade water limits may be insufficient.
Electronic-grade isopropyl alcohol has a secondary application in high-reliability printed circuit board assembly and vapour degreasing where nonconductive residue must remain below military and aerospace inspection thresholds. In a vapour degreaser, the solvent is heated in a sump, condensed on the workpiece, and continuously purified by thermal transfer. Low water content prevents phase-split stains and reduces the risk of chloride-induced electromigration. Process equipment is usually an open-top or enclosed degreaser with water-cooled or refrigerant condensation coils; because the flash point is near 12 °C, the installation must meet explosion-proof electrical classification and ventilation requirements. Lihuayi Weiyuan product is not a drop-in replacement for high-boiling fluorinated degreasers in every equipment layout. Its evaporation rate and lower flammable limit of 2.0 vol% impose specific interlocks on temperature control and airflow. For stencil cleaning after solder paste printing, the solvent residue must be validated by ionic conductivity of the washed extract, commonly using IPC-TM-650 method 2.3.25 or an equivalent resistivity procedure. Electronic-grade material is preferred over technical grade because technical-grade solvent can leave a visible white film after air drying, originating from sulfate, chloride, and high-boiling organic impurities. The product is also compatible with general polyurethane, epoxy, and acrylic conformal coating wipe-down operations, provided the user verifies that the coating has cured sufficiently and that water content in the solvent is below the coating's moisture tolerance.
| Aspect | Method/standard | Electronic-grade control band | Commodity/technical IPA typical band |
|---|---|---|---|
| Assay as 2-propanol | GC-FID internal normalization | ≥99.5 wt% | ≥99.0 wt% |
| Water content | ASTM E203 Karl Fischer titration | ≤1000 ppm (0.1 wt%) | 2000–5000 ppm |
| Residue after evaporation | ASTM D1353 | ≤10 mg/L | 20–100 mg/L |
| Acidity as acetic acid | ASTM D1613 | ≤10 mg/kg | 20–50 mg/kg |
| Trace elements Na, K, Mg, Ca, Fe, Ni, Cu, Zn | ICP-MS after evaporation | ≤1 µg/L per element | not routinely controlled |
| Particle count ≥0.2 µm | Laser particle counter, SEMI C8 framework | ≤100 counts/mL | not routinely specified |
Because the electronics industry does not operate under one universal impurity ceiling for every cleanroom operation, the table entries are initial qualification benchmarks rather than a substitute for process-specific validation. Advanced front-end fabs may tighten water and metal limits below these figures, while assembly and display operations may accept the standard electronic-grade band. The supplier's certificate of analysis remains the only valid source of lot release values, and users should compare the reported values against their own analytical instruments because inter-laboratory bias in ICP-MS and Karl Fischer testing can be as large as the specification margin.
Relative to other electronic-grade polar solvents such as acetone or methanol, isopropanol has a boiling point of 82.4 °C and a solvent polarity expressed as a dielectric constant near 18.3 at 25 °C. This moderate polarity supports the dissolution of low molecular weight process oils and fingerprints while still being compatible with many wafer surfaces. Acetone has a lower boiling point and higher drying speed but also higher flammability and a stronger odor; methanol is water-miscible and has a higher dipole moment but is more toxic. The choice between these solvents in a cleaning application is driven by residue tolerance, drying time, and chemical compatibility with the substrate. Electronic-grade isopropanol is therefore selected where a low-water alcohol with a controlled ionic and particle burden is required, but where the processing latitude does not require a higher boiling solvent such as propylene glycol monomethyl ether acetate. The product should not be viewed as a universal cleaner; its utility is highest in single-step or intermediate clean-and-dry processes where the material's evaporation behavior is integral to the defect performance.
Operational boundaries for this product derive from its flammability, hygroscopicity, and solvent power. The liquid should not be stored near strong oxidizers, nitric acid, or open ignition sources because the lower flammable limit is 2.0 vol% and the autoignition temperature is approximately 399 °C. Processing vessels should be electrically grounded, and transfer pumps should be rated for flammable solvents. Materials of construction should be selected for isopropanol service: passivated 316L stainless steel, PTFE, PVDF, and high-density polyethylene are generally acceptable, while natural rubber and many flexible elastomers can swell or extract ion-bearing compounds. Contact with aluminum should be evaluated in closed heated systems because specific conditions can promote reaction and container-wall contamination. The product should not be blended with amine-based additives in cleaning formulations without storage-stability testing because acid-base reactions, moisture uptake, and container wall interactions can shift the contaminant profile. The electronic-grade certificate does not remove the need for end-user drying and filtration; it establishes the initial liquid cleanliness at the fill point.
For regulatory documentation, the material falls under the EU REACH registration requirements for 2-propanol and is not routinely classified as a substance requiring restriction under RoHS Directive 2011/65/EU for the intended electronic cleaning application. RoHS applies to the finished electrical or electronic equipment rather than to process chemicals. Safety data sheets should be consulted for flammability, toxicity, and transport classification. The product is a Class 3 flammable liquid under transport regulations, and storage limits may be governed by local fire codes. These regulatory statements are generic to isopropanol and do not replace a site-specific chemical compatibility review.
Practical incoming inspection for this product in high-volume semiconductor manufacturing includes particle counts from the container, forced evaporation onto silicon witness wafers, and ion chromatography of the solvent extract. Container cleanliness contributes substantially to first-use performance. Reused stainless steel canisters without documented passivation and purge can reintroduce iron and chromium after the liquid leaves the fill line, and fluorinated HDPE drums can develop surface charge that complicates particle discharge. Therefore, the difference between Lihuayi Weiyuan electronic-grade IPA and commodity alcohol extends from the analytical certification into transfer hardware and dispensing discipline. The solvent should be recirculated through cleanroom-compatible filtration and stored under dry gas blanketing when ambient relative humidity is high. Isopropanol is hygroscopic and will absorb atmospheric water; open handling at high relative humidity degrades the moisture specification and can shift the azeotrope sufficiently to reduce drying performance. For a user requiring water below 500 ppm for advanced high-aspect-ratio drying, the standard electronic-grade product should be supplemented with a low-water packaging option or point-of-use membrane drying, as published data for this specific configuration is limited.