| HS Code | 265402 |
| Product Name | Jinzhou Petrochemical Co Ltd Isopropyl Alcohol Electronic Grade |
| Chemical Name | Isopropyl Alcohol |
| Chemical Formula | C3H8O |
| Cas Number | 67-63-0 |
| Molecular Weight | 60.10 g/mol |
| Purity Assay | ≥99.9% |
| Water Content | ≤0.02% |
| Residue On Evaporation | ≤5 ppm |
| Acidity As Acetic Acid | ≤10 ppm |
| Color Apha | ≤10 |
| Density 20 C | 0.785 g/cm³ |
As an accredited Jinzhou Petrochemical Co Ltd Isopropyl Alcohol Electronic Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Supplied in 200 kg sealed drums, this electronic-grade isopropyl alcohol ensures high purity for precision cleaning and manufacturing. |
| Container Loading (20′ FCL) | Container Loading (20′ FCL): Loading Jinzhou Petrochemical’s electronic-grade isopropyl alcohol into a 20-foot full container, ensuring safe, secure transport. |
| Shipping | Jinzhou Petrochemical’s electronic-grade isopropyl alcohol ships in sealed, contamination-free containers to preserve ultra-high purity. Transport follows strict hazardous material protocols, avoiding moisture and static. Dedicated tankers or drums with inert blanketing ensure stability, with temperature control and proper labeling for safe, compliant delivery to semiconductor facilities. |
| Storage | Store in a cool, dry, well-ventilated area away from heat, ignition sources, and strong oxidizers. Keep containers tightly sealed to prevent moisture absorption and maintain electronic-grade purity. Use approved, grounded containers and avoid prolonged exposure to air. Follow all fire safety and hazardous material handling regulations. |
| Shelf Life | Shelf life is typically 24 months when stored unopened in original containers, kept cool, dry, and away from sunlight. |
In front-end semiconductor fabrication, electronic-grade isopropyl alcohol supplied by Jinzhou Petrochemical Co Ltd functions as the final organic rinse and moisture-displacement agent after aqueous process baths, particularly post-RCA SC-1 and SC-2 sequences, post-CMP cleaning, and pre-spin drying. On single-wafer spin processors, the solvent is dispensed at flow rates of 1.0–2.0 L/min onto 300 mm wafers rotating at 300–800 rpm, often followed by a low-speed rinse period that is terminated once the residual water layer is displaced. The material specified against SEMI C21-0618 is used undiluted at 99.99% assay and <50 ppm water for final surface drying; intermediate organic-residue removal blends 70 vol% IPA with 30 vol% ultrapure water at 18 MΩ·cm resistivity. Marangoni drying units introduce IPA vapour at the meniscus, with typical mass flow rates of 30–200 mL/min, creating surface-tension gradients that pull deionized water from high-aspect-ratio features without pattern collapse. Megasonic immersion tools operating between 700 kHz and 1 MHz may receive low additions of 1–3 vol% IPA to reduce cavitation threshold and improve particle removal. Process bays are controlled under ISO 14644-1 Class 5 cleanroom conditions, and the solvent is excluded from heated SC-1 or SC-2 baths because its flash point of 12 °C and incompatibility with strong oxidizers create a vapour ignition hazard. End product types associated with this application include advanced logic, DRAM, NAND flash, CMOS image sensors, and power management integrated circuits on silicon wafers.
Defluxing after reflow or wave soldering uses electronic-grade IPA where rosin, no-clean, and water-soluble flux residues must be removed from under low-standoff components before conformal coating or final inspection. For benchtop repair and rework, undiluted 99.9% IPA is delivered through brush, swab, or controlled aerosol dispensers; for inline defluxing, the solvent is blended at 10–15 vol% with deionized water and 2–5 vol% saponifier, with wash section temperature maintained at 40–55 °C. Stencil underside wiping in solder paste printing consumes 100% electronic-grade IPA through automatic stencil wipers cycling every 3–7 print strokes to dissolve flux vehicle without swelling polymer squeegee blades. The controlling cleanliness documents are IPC J-STD-001H, IPC-CH-65B, and IPC-A-610H; when ionic contamination is critical, surface insulation resistance is verified under IPC-TM-650 2.6.3.3 at 85 °C and 85% RH with 100 V DC bias. Downstream process equipment includes inline spray-in-air defluxing lines with 3–5 wash stages, ultrasonic immersion tanks operating at 40 kHz, and batch centrifugal dryers. Open heated baths of IPA are prohibited in standard PCB cleaning cells due to the flash point, and IPA is not used for assemblies requiring only visual no-clean residue acceptance because complete removal can cause capillary collapse under bottom-terminated components. End product types include automotive engine control units, industrial motor drives, power modules, aerospace avionics boards, and consumer electronics motherboards.
Flat-panel display substrate preparation uses electronic-grade IPA in vertical in-line wet processors where glass substrates are cleaned before sputter metallization, plasma-enhanced chemical vapour deposition, or photolithography. A common working solution is 70:30 IPA to deionized water for light organic contamination after cutting and grinding; the final rinse zone applies undiluted 99.99% assay solvent to prevent drying stains, mura, and particle adhesion on glass substrate generations from 6 to 10.5. Cleaning lines comply with ISO 14644-1 Class 4 cleanroom limits and use IPA supplied under SEMI C21-0618, with incoming QA for particles ≥0.2 µm and metal cation content below 10 ppb. Downstream process equipment includes brush scrubbers followed by high-pressure spray, megasonic immersion at 950 kHz, and air-knife drying; the solvent is also applied as a rinse after developer processing in TFT photolithography, but it is not used as a photoresist solvent. For OLED frontplane production, final IPA rinse is completed before organic evaporation to prevent outgassing-related dark spot defects. Operational boundaries include restricted use on polarizer rolls, adhesive laminates, and inkjet-printed alignment layers where IPA uptake can cause swelling or dimensional change. End product types include television panels, desktop monitors, mobile AMOLED displays, automotive instrument displays, and projected capacitive touch sensor laminates.
In lithium-ion cell manufacturing, electronic-grade IPA is deployed as a final cleaning solvent for electrode edges, cell cans, tabs, and fixture surfaces before electrolyte filling. The solvent is used undiluted at 99.99% for critical sealing surfaces, while 70:30 IPA to deionized water is applied to stainless steel fixtures and transport trays; all aqueous cleaning is followed by vacuum drying because residual moisture in the dry room must remain below 300 ppm by volume. Cleanliness for electrode preparation is typically maintained under ISO 14644-1 Class 7 or better, and lithium-ion traction cell qualification follows IEC 62660-1. The solvent is screened against SEMI C21-0618 for metal cations below 10 ppb, because leached iron, copper, or zinc can deposit on anode surfaces and promote micro-short formation after formation cycling. Downstream process equipment includes automatic spray cleaning cabinets with clean dry air blow-off, ultrasonic rinse modules operating at 30–40 kHz, and vacuum ovens set below 45 °C to avoid thermal stress on separator and tab insulation. IPA is applied after welding and before electrolyte filling; it is never applied after electrolyte due to the risk of washing conductive salt residues and creating flammable vapour in confined cell assembly lines. End product types include prismatic and pouch cells for electric vehicle battery packs, cylindrical cells for power tools and e-mobility, and energy storage system modules for grid balancing.
Fibre optic termination and splice-on-connector workflows use electronic-grade IPA to remove buffer gel, dust, and index-matching residue from connector end-faces and bare fibre. The solvent is applied undiluted at 99.9% through sealed single-use cleaning cassettes or optical-grade lint-free wipes; dilution with general-purpose IPA is avoided because trace hydrocarbons or water impurities leave streaks that increase insertion loss and back-reflection. The governing inspection criteria are IEC 61300-3-35 for connector end-face quality and IEC 61300-3-4 for insertion loss measurement, while assembly areas generally operate under ISO 14644-1 Class 8 minimum. Addition ratio is 0.5–1.0 mL per cleaning event, dispensed to the wipe or cassette tape rather than directly to the ferrule to avoid liquid infiltration into the connector body. Production sequences include fibre stripping, cleaving, solvent cleaning, arc fusion splicing, heat-shrink protection, and automated interferometer inspection. Operational boundaries include prohibition of bulk immersion of pre-terminated connectors in IPA because plastic housings and epoxy bonding may swell, and exclusion of IPA near active fusion splicer arcs due flammability. End product types include single-mode and multi-mode patch cords, optical transceivers, MPO/MTP assemblies, active optical cables, and fibre-to-the-home drop cable connectors.
LED fabrication lines apply electronic-grade IPA after wafer thinning, dicing, and die attach preparation to remove lapping oil, diamond slurry, and sub-surface particles from gallium nitride, gallium arsenide, and sapphire substrates. The solvent is used neat at 99.99% assay with moisture below 0.1% for final die cleaning, while a 20 vol% IPA in deionized water mixture is used in post-dicing batch ultrasonic cleaners at 25–40 °C to reduce cutting fluid viscosity and improve particle suspension. Compliance references include SEMI C21-0618 for incoming solvent purity and ISO 14644-1 Class 6 for die bonding area cleanliness, with package-level lumen maintenance testing performed under IES LM-80. Downstream process equipment includes centrifugal spray rinsers, carbon dioxide-assisted cleaning, and vacuum baking stages below 60 °C before wire bonding. IPA is not a universal solution for wafer-level packaging residues; fully crosslinked die-attach films and silicone or epoxy bleed-out require halogen-free formulated solvents, because IPA leaves volatile residues that compromise wire-bond adhesion and mould compound interface quality. End product types include surface-mount LED chips for automotive lighting, general illumination, backlight modules, horticultural lighting, and micro-LED display prototypes.
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Product identifier: Jinzhou Petrochemical Co Ltd Isopropyl Alcohol Electronic Grade, CAS 67-63-0, is a high-purity 2-propanol stream qualified for cleaning and drying operations in semiconductor and microelectronics fabrication. Published data for this specific configuration is limited; therefore the specification envelope discussed below is drawn from the SEMI C35 electronic-grade class and ASTM D770 technical-grade baseline, not from a standalone public datasheet. No separate model designation appears in current public documentation. Supply packages for material in this class typically include bulk isotainers, fluoropolymer-coated drums, or high-density polyethylene containers. A lot-specific certificate of analysis should be obtained from Jinzhou Petrochemical before process qualification because cation, anion, water, and particle limits are lot-dependent in electronic-grade solvents.
The product belongs to the class of electronics-grade 2-propanol obtained by propylene hydration followed by rectification and contaminant polishing. In typical production, technical-grade IPA is dehydrated by extractive distillation or pressure-swing adsorption, then passed through ion-exchange polishing beds and sub-micrometre filtration before packaging. The purification sequence reduces metal cations, carbonyls, water, and high-boiling residues that would otherwise remain on patterned wafer surfaces. Unlike pharmaceutical-grade IPA, which is controlled for microbial and pyrogen content, electronic-grade IPA is not typically tested for endotoxins but is controlled for metal cations, anions, and particle burdens relevant to device yield.
Under ASTM D770, general-purpose isopropyl alcohol allows assay as low as 99.5 wt% and does not impose the cation or particle ceilings required for wafer contact. Electronic-grade 2-propanol in the class represented by this product is controlled for individual metal cations at low part-per-billion levels, low non-volatile residue, and low particle burdens. These additional constraints prevent ionic contamination from contributing to surface charge defects after RCA cleaning and from generating time-zero leakage failures in high-density interconnect assemblies.
| Parameter | Electronic-grade envelope | Technical-grade reference |
|---|---|---|
| Assay as 2-propanol | ≥ 99.99 wt% | ≥ 99.5 wt% per ASTM D770 |
| Water | 100–300 ppm | ≤ 2,000 ppm |
| Non-volatile residue | 1–5 ppm | Not specified |
| Acidity | ≤ 0.5 µeq/g | ≤ 0.002 wt% as acetic acid |
| Color | ≤ 5 APHA | ≤ 10 APHA |
| Density at 20 °C | 0.785–0.787 g/cm³ | 0.782–0.789 g/cm³ |
| Individual metal cations | 1–10 ppb each | Not specified |
| Particles ≥ 0.5 µm per mL | ≤ 25 | Not specified |
| Chloride | ≤ 10 ppb | Not specified |
In practice, assay alone does not establish electronic-grade suitability. A batch with 99.98 wt% assay can fail electronic qualification if sodium, potassium, iron, copper, chloride, or sulfate exceed the contamination budget for a front-end cleaning line. The certificate of analysis should therefore include inductively coupled plasma mass spectrometry cation data, ion chromatography anion data, Karl Fischer water content, and optical particle counts after 0.05 µm filtration.
Electronic-grade IPA specifications in the SEMI C35-0708 family classify metal contamination by individual cation rather than total residue alone. Cation ceilings for sodium, potassium, iron, copper, nickel, zinc, calcium, magnesium, and aluminium are commonly 1–10 ppb. Anion ceilings for chloride, sulfate, and nitrate are commonly 10–50 ppb. Inductively coupled plasma mass spectrometry with cold plasma or collision-cell mode is required to achieve detection limits below 0.1 ppb for critical transition metals. Particle control is measured by optical particle counter on samples drawn through a 0.5 µm detection threshold.
| Property | Typical electronic-grade limit | Test method/instrument |
|---|---|---|
| Assay as 2-propanol | ≥ 99.99 wt% | GC-FID |
| Water | 100–300 ppm | Karl Fischer, ASTM D1364 |
| Non-volatile residue | 1–5 ppm | ASTM D1353 |
| Acidity | ≤ 0.5 µeq/g | ASTM D1613 |
| Density at 20 °C | 0.785–0.787 g/cm³ | ASTM D4052 |
| Color | ≤ 5 APHA | ASTM D1209 |
| Individual metal cations | 1–10 ppb | ICP-MS |
| Chloride and sulfate | ≤ 10–50 ppb | Ion chromatography |
| Particles ≥ 0.5 µm | ≤ 25 particles/mL | Optical particle counter |
The analytical methods require matrix-matched blanks and internal standard addition because 2-propanol is a carbon-rich solvent that can produce polyatomic interferences in ICP-MS. Sample handling for trace metal analysis should use pre-cleaned perfluoroalkoxy alkane or high-density polyethylene containers. Glass containers can contribute sodium, potassium, and boron; metal containers can contribute iron and chromium. Particle counting is sensitive to vial shedding, so vials should be rinsed with the same electronic-grade IPA before sampling.
In semiconductor front-end cleaning, electronic-grade IPA is introduced after ultrapure water rinse in Marangoni drying modules. The surface-tension gradient generated by IPA vapour above the substrate removes water from the meniscus without high-velocity air impingement. On a single-wafer spin processor equipped with an ultrapure water manifold and an IPA vapour condenser, the final dry sequence may include a 60 s ultrapure water rinse, 15–30 s IPA mist dispense, and spin drying at 1,200–2,500 rpm. The use of technical-grade IPA in this sequence can leave non-volatile residues as sub-monolayer films on gate oxide or back-end-of-line damascene surfaces. The electronic-grade material is also used in RCA cleaning sequences after dilute hydrofluoric acid or ammonia-peroxide mixtures, where low metal content reduces re-deposition of cations on hydrophobic silicon.
Additional use contexts include precision cleaning of flat-panel display substrates and printed circuit board assemblies where flux residues require removal. In printed circuit board defluxing, IPA is applied through spray-under-immersion or airless spray systems. The electronic-grade material avoids ionic residues that can produce leakage currents in high-density interconnect assemblies. Ionic cleanliness can be verified by IPC-TM-650 method 2.3.28 using the electronic-grade IPA as part of the extraction medium.
Electronic-grade 2-propanol is hygroscopic. Open-container exposure at relative humidity above 55–60 % raises water content by 100–200 ppm within several hours, depending on free surface area and air exchange. For point-of-use dispense systems, the product should be blanketed with dry nitrogen at 5–10 psig or dispensed through a sealed pump with a molecular-sieve vent dryer. Containers should not be left open for more than 10–15 min during transfer in an ISO 14644-1 Class 5 cleanroom. Bulk storage tanks should be equipped with nitrogen purge and pressure-vacuum relief valves to prevent atmospheric moisture ingress.
Wetted materials in dispense lines should be selected for low extractable metal content and low particle shedding. Fluorinated HDPE and PTFE are preferred; 316L stainless steel is acceptable only when fully passivated and verified for iron and chromium leaching. Unpassivated carbon steel and copper-containing alloys should be avoided in vapour recovery and transfer lines because trace metal dissolution can shift the cation specification. Strong oxidizers, acid anhydrides, halogens, and concentrated nitric acid should be stored separately from electronic-grade IPA to prevent exothermic or radical-generating reactions. The operational boundary for water-sensitive processes is generally set by the wafer drying tool qualification: if water specification is 100 ppm maximum and ambient relative humidity exceeds 60 %, container openings should be restricted to 10 min per batch transfer.
Lot qualification for Jinzhou Petrochemical Co Ltd Isopropyl Alcohol Electronic Grade should require a certificate of analysis containing assay, water, non-volatile residue, acidity, density, color, particle counts, and an ICP-MS cation panel. Because no current public datasheet provides a complete specification table for this specific product, process owners should compare supplier data against the SEMI C35-0708 electronic-grade envelope and internal contamination budgets for the target technology node. Published data for this specific configuration is limited; the limits above are a supplier-neutral reference and should not substitute for direct vendor qualification.
